Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Infineon |
package instruction | LEAD FREE, SO-8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 15 weeks |
Avalanche Energy Efficiency Rating (Eas) | 250 mJ |
Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 30 V |
Maximum drain current (Abs) (ID) | 11 A |
Maximum drain current (ID) | 11 A |
Maximum drain-source on-resistance | 10.8 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
Humidity sensitivity level | 1 |
Number of components | 2 |
Number of terminals | 8 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 2 W |
Maximum pulsed drain current (IDM) | 89 A |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |