EEWORLDEEWORLDEEWORLD

Part Number

Search

SL8480D

Description
NAND Gate, TTL, CDFP14
Categorylogic   
File Size244KB,3 Pages
ManufacturerLansdale
Websitehttp://www.lansdale.com/
Download Datasheet Parametric Compare View All

SL8480D Overview

NAND Gate, TTL, CDFP14

SL8480D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLansdale
package instructionDFP, FL14,.3
Reach Compliance Codecompliant
Is SamacsysN
JESD-30 codeR-XDFP-F14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL14,.3
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Schmitt triggerNO
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

SL8480D Related Products

SL8480D SL8481D SL8480C SL8470D SL8470C SL8415D
Description NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDIP14 NAND Gate, TTL, PDFP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Lansdale Lansdale Lansdale Lansdale Lansdale Lansdale
package instruction DFP, FL14,.3 DFP, FL14,.3 DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3 DFP, FL14,.3
Reach Compliance Code compliant compliant compliant compliant compliant compliant
JESD-30 code R-XDFP-F14 R-XDFP-F14 R-XDIP-T14 R-XDFP-F14 R-XDIP-T14 R-PDFP-F14
JESD-609 code e0 e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DFP DFP DIP DFP DIP DFP
Encapsulate equivalent code FL14,.3 FL14,.3 DIP14,.3 FL14,.3 DIP14,.3 FL14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK IN-LINE FLATPACK IN-LINE FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO
surface mount YES YES NO YES NO YES
technology TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT FLAT THROUGH-HOLE FLAT THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Is Samacsys N N N N N -
Base Number Matches 1 1 1 1 1 -
[Jihai APM32E103VET6S development board] Evaluation 2, Development environment
[i=s]This post was last edited by wenyangzeng on 2022-9-12 19:07[/i][Jihai APM32E103VET6S development board] Evaluation 2, Development environmentFrom the schematic diagram, we can see that PB8 and PB...
wenyangzeng Domestic Chip Exchange
[EVK-NINA-B400 Evaluation Kit] + First Meeting
[i=s]This post was last edited by damiaa on 2021-5-14 11:34[/i][EVK-NINA-B400 Evaluation Kit] + First Meeting I got the EVK-NINA-B400 a few days ago. I made some preparations over the weekend and toda...
damiaa RF/Wirelessly
msp430 LCD driver module
1. Power saving (because the liquid crystal itself does not emit light, the power consumption is low) 2. Can only be driven by low-frequency AC voltage, DC will damage the LCD 3. Types: segment LCD, c...
火辣西米秀 Microcontroller MCU
EEWORLD University Hall----Combining buck-boost topology and USB Type C? Power Delivery to achieve maximum power density
Combining buck-boost topology with USB Type C? Power Delivery to achieve maximum power density : https://training.eeworld.com.cn/course/27353...
hi5 Talking
How to use high-speed ADCs and DACs with FPGAs
...
至芯科技FPGA大牛 FPGA/CPLD
The widespread application of RFID will effectively improve the level of urban management
[Abstract] If RFID is to be used in urban management, there are still many problems, such as security and privacy issues. For example, the RFID chip used in the manhole cover has problems such as data...
tmily RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号