|
EDE1108AASE-4A-E |
EDE1104AASE-5C-E |
EDE1104AASE-6C-E |
EDE1104AASE-4A-E |
EDE1108AASE-6C-E |
EDE1108AASE-5C-E |
Description |
DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68 |
DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68 |
DDR DRAM, 256MX4, CMOS, PBGA68, LEAD FREE, FBGA-68 |
DDR DRAM, 256MX4, 0.6ns, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68 |
DDR DRAM, 128MX8, CMOS, PBGA68, LEAD FREE, FBGA-68 |
DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
ELPIDA |
ELPIDA |
ELPIDA |
ELPIDA |
ELPIDA |
ELPIDA |
Parts packaging code |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
package instruction |
TFBGA, BGA68,9X19,32 |
TFBGA, BGA68,9X19,32 |
TFBGA, BGA68,9X19,32 |
TFBGA, BGA68,9X19,32 |
TFBGA, BGA68,9X19,32 |
TFBGA, BGA68,9X19,32 |
Contacts |
68 |
68 |
68 |
68 |
68 |
68 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Is Samacsys |
N |
N |
N |
N |
N |
N |
access mode |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
interleaved burst length |
4,8 |
4,8 |
4,8 |
4,8 |
4,8 |
4,8 |
JESD-30 code |
R-PBGA-B68 |
R-PBGA-B68 |
R-PBGA-B68 |
R-PBGA-B68 |
R-PBGA-B68 |
R-PBGA-B68 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
length |
20.7 mm |
20.7 mm |
20.7 mm |
20.7 mm |
20.7 mm |
20.7 mm |
memory density |
1073741824 bit |
1073741824 bit |
1073741824 bit |
1073741824 bit |
1073741824 bit |
1073741824 bit |
Memory IC Type |
DDR DRAM |
DDR DRAM |
DDR DRAM |
DDR DRAM |
DDR DRAM |
DDR DRAM |
memory width |
8 |
4 |
4 |
4 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
68 |
68 |
68 |
68 |
68 |
68 |
word count |
134217728 words |
268435456 words |
268435456 words |
268435456 words |
134217728 words |
134217728 words |
character code |
128000000 |
256000000 |
256000000 |
256000000 |
128000000 |
128000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
organize |
128MX8 |
256MX4 |
256MX4 |
256MX4 |
128MX8 |
128MX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TFBGA |
TFBGA |
TFBGA |
TFBGA |
TFBGA |
Encapsulate equivalent code |
BGA68,9X19,32 |
BGA68,9X19,32 |
BGA68,9X19,32 |
BGA68,9X19,32 |
BGA68,9X19,32 |
BGA68,9X19,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
refresh cycle |
8192 |
8192 |
8192 |
8192 |
8192 |
8192 |
Maximum seat height |
1.12 mm |
1.12 mm |
1.13 mm |
1.12 mm |
1.13 mm |
1.12 mm |
self refresh |
YES |
YES |
YES |
YES |
YES |
YES |
Continuous burst length |
4,8 |
4,8 |
4,8 |
4,8 |
4,8 |
4,8 |
Maximum supply voltage (Vsup) |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
Minimum supply voltage (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
OTHER |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
50 |
NOT SPECIFIED |
50 |
NOT SPECIFIED |
width |
10.2 mm |
10.2 mm |
10.2 mm |
10.2 mm |
10.2 mm |
10.2 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
Maximum access time |
0.6 ns |
0.5 ns |
- |
0.6 ns |
- |
0.5 ns |
Maximum clock frequency (fCLK) |
200 MHz |
267 MHz |
- |
200 MHz |
- |
267 MHz |