Gap Pad A2000
®
High Performance,Thermally Conductive Gap Filling Material
Features and Benefits
• Thermal conductivity: 2.0 W/m-K
• Fiberglass reinforced for puncture, shear
and tear resistance
• Electrically isolating
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Inherent Surface Tack (1- or 2-sided)
Density (g/cc)
Heat Capacity (J/g-K)
Hardness, Bulk Rubber (Shore 00) (1)
Young’s Modulus (psi) / (kPa) (2)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF GAP PAD A2000
IMPERIAL VALUE
Gray
Fiberglass
0.010 to 0.040
2
2.9
1.0
80
55
-76 to 392
>4000
6.0
10
11
V-O
2.0
METRIC VALUE
Gray
Fiberglass
0.254 to 1.016
2
2.9
1.0
80
379
-60 to 200
>4000
6.0
10
11
V-O
2.0
TEST METHOD
Visual
—
ASTM D374
—
ASTM D792
ASTM E1269
ASTM D2240
ASTM D575
—
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
Gap Pad A2000 acts as a thermal interface
and electrical insulator between electronic
components and heat sinks. In the thickness
range of 10 to 40 mil, Gap Pad A2000 is
supplied with natural tack on both sides,
allowing for excellent compliance to the
adjacent surfaces of components.The 40 mil
material thickness is supplied with lower tack
on one side, allowing for burn-in processes
and easy rework.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad A2000
40
35
30
25
20
15
10
0.20
Resultant Thickness (mils)
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch
2
. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Computer and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
• DDR SDRAM memory modules
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
0.30 0.40 0.50 0.60 0.70
Thermal Resistance (C-in
2
/W)
0.80
Building a Part Number Standard Options
GPA2000
–
0.010
– 02
– 0816 –
NA
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020"
0.040"
GPA2000 = Gap Pad A2000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad
®
: U.S. Patent 5,679,457 and others
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_A2000_12.08
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