MT41K256M16TW-107 AIT:P TR datasheet, PDF

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MT41K256M16TW-107 AIT:P TR: DescriptionDynamic Random Access Memory DDR3 4G 256MX16 FBGA; Categorysemiconductor Memory IC Dynamic random access memory; File Size15MB，202 Pages; ManufacturerMicron; Websitehttp://www.micron.com/; Environmental Compliance

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MT41K256M16TW-107 AIT:P TR Overview

Dynamic Random Access Memory DDR3 4G 256MX16 FBGA

MT41K256M16TW-107 AIT:P TR Parametric

Parameter Name	Attribute value
Maker	Micron
Product Category	dynamic random access memory
type	SDRAM - DDR3L
Data bus width	16 bit
organize	256 M x 16
Package/box	FBGA-96
storage	4 Gbit
maximum clock frequency	933 MHz
Supply voltage - max.	1.45 V
Supply voltage - min.	1.283 V
Supply current—max.	91 mA
Minimum operating temperature	- 40 C
Maximum operating temperature	+ 95 C
series	MT41K
Encapsulation	Cut Tape
Encapsulation	MouseReel
Encapsulation	Reel
Installation style	SMD/SMT
Factory packaging quantity	2000

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4Gb: x8, x16 Automotive DDR3L SDRAM

Description

Automotive DDR3L SDRAM

MT41K512M8 – 64 Meg x 8 x 8 banks

MT41K256M16 – 32 Meg x 16 x 8 banks

Description

DDR3L SDRAM (1.35V) is a low voltage version of the

DDR3 (1.5V) SDRAM. Refer to DDR3 (1.5V) SDRAM

(Die Rev :E) data sheet specifications when running in

1.5V compatible mode.

Options

• Configuration

– 512 Meg x 8

– 256 Meg x 16

• FBGA package (Pb-free) – x8

– 78-ball (8mm x 10.5mm)

• FBGA package (Pb-free) – x16

– 96-ball (8mm x 14mm)

• Timing – cycle time

– 1.07ns @ CL = 13 (DDR3-1866)

• Product certification

– Automotive

• Operating temperature

– Industrial (–40°C

≤

+95°C)

– Automotive (–40°C

≤

+105°C)

– Ultra-high (–40°C

≤

+125°C)

• Revision

Note:

Marking

512M8

256M16

-107

Features

• V

= V

DDQ

= 1.35V (1.283–1.45V)

• Backward compatible to V

= V

DDQ

= 1.5V ±0.075V

– Supports DDR3L devices to be backward com-

patible in 1.5V applications

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• T

of -40°C to +125°C

– 64ms, 8192-cycle refresh at -40°C to +85°C

– 32ms at +85°C to +105°C

– 16ms at +105°C to +115°C

– 8ms at +115°C to +125°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Write leveling

• Multipurpose register

• Output driver calibration

• AEC-Q100

• PPAP submission

• 8D response time

Table 1: Key Timing Parameters

Speed Grade

-107

Data Rate (MT/s)

1866

1. Not all options listed can be combined to de-

fine an offered product. Use the part catalog

search on http://www.micron.com for availa-

ble offerings.

2. The datasheet does not support ×4 mode

even though ×4 mode description exists in the

following sections.

3. The UT option use based on automotive us-

age model. Please contact Micron sales repre-

sentative if you have questions.

Target

RCD-

RP-CL

13-13-13

RCD

(ns)

CL (ns)

13.91

CCMTD-1725822587-10208

automotive_4gb_ddr3l_v00h.pdf - Rev. F 02/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

4Gb: x8, x16 Automotive DDR3L SDRAM

Description

Contents

Important Notes and Warnings ....................................................................................................................... 11

State Diagram ................................................................................................................................................ 12

Functional Description ................................................................................................................................... 13

Industrial Temperature ............................................................................................................................... 13

Automotive Temperature ............................................................................................................................ 13

Utra-high Temperature ............................................................................................................................... 14

General Notes ............................................................................................................................................ 14

Functional Block Diagrams ............................................................................................................................. 15

Ball Assignments and Descriptions ................................................................................................................. 17

Package Dimensions ....................................................................................................................................... 23

Electrical Specifications .................................................................................................................................. 25

Absolute Ratings ......................................................................................................................................... 25

Input/Output Capacitance .......................................................................................................................... 26

Thermal Characteristics .................................................................................................................................. 27

Electrical Specifications – I

Specifications and Conditions ............................................................................ 29

Electrical Characteristics – Operating I

Specifications .................................................................................. 40

Electrical Specifications – DC and AC .............................................................................................................. 42

DC Operating Conditions ........................................................................................................................... 42

Input Operating Conditions ........................................................................................................................ 43

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 47

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 50

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 52

ODT Characteristics ....................................................................................................................................... 53

1.35V ODT Resistors ................................................................................................................................... 54

ODT Sensitivity .......................................................................................................................................... 55

ODT Timing Definitions ............................................................................................................................. 55

Output Driver Impedance ............................................................................................................................... 59

34 Ohm Output Driver Impedance .............................................................................................................. 60

DDR3L 34 Ohm Driver ................................................................................................................................ 61

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 62

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 63

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 63

Output Characteristics and Operating Conditions ............................................................................................ 65

Reference Output Load ............................................................................................................................... 68

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 68

Slew Rate Definitions for Differential Output Signals .................................................................................... 70

Speed Bin Tables ............................................................................................................................................ 71

Electrical Characteristics and AC Operating Conditions ................................................................................... 76

Command and Address Setup, Hold, and Derating ........................................................................................... 85

Data Setup, Hold, and Derating ....................................................................................................................... 92

Commands – Truth Tables ............................................................................................................................. 100

Commands ................................................................................................................................................... 103

DESELECT ................................................................................................................................................ 103

NO OPERATION ........................................................................................................................................ 103

ZQ CALIBRATION LONG ........................................................................................................................... 103

ZQ CALIBRATION SHORT .......................................................................................................................... 103

ACTIVATE ................................................................................................................................................. 103

READ ........................................................................................................................................................ 103

WRITE ...................................................................................................................................................... 104

PRECHARGE ............................................................................................................................................. 105

CCMTD-1725822587-10208

automotive_4gb_ddr3l_v00h.pdf - Rev. F 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

4Gb: x8, x16 Automotive DDR3L SDRAM

Description

REFRESH .................................................................................................................................................. 105

SELF REFRESH .......................................................................................................................................... 106

DLL Disable Mode ..................................................................................................................................... 107

Input Clock Frequency Change ...................................................................................................................... 111

Write Leveling ............................................................................................................................................... 113

Write Leveling Procedure ........................................................................................................................... 115

Write Leveling Mode Exit Procedure ........................................................................................................... 117

Initialization ................................................................................................................................................. 118

Voltage Initialization / Change ....................................................................................................................... 120

Voltage Switching ............................................................................................................................... 121

Mode Registers .............................................................................................................................................. 122

Mode Register 0 (MR0) ................................................................................................................................... 123

Burst Length ............................................................................................................................................. 123

Burst Type ................................................................................................................................................. 124

DLL RESET ................................................................................................................................................ 125

Write Recovery .......................................................................................................................................... 126

Precharge Power-Down (Precharge PD) ...................................................................................................... 126

CAS Latency (CL) ....................................................................................................................................... 126

Mode Register 1 (MR1) ................................................................................................................................... 128

DLL Enable/DLL Disable ........................................................................................................................... 128

Output Drive Strength ............................................................................................................................... 129

OUTPUT ENABLE/DISABLE ...................................................................................................................... 129

TDQS Enable ............................................................................................................................................. 129

On-Die Termination .................................................................................................................................. 130

WRITE LEVELING ..................................................................................................................................... 130

POSTED CAS ADDITIVE Latency ................................................................................................................ 130

Mode Register 2 (MR2) ................................................................................................................................... 131

CAS WRITE Latency (CWL) ........................................................................................................................ 132

AUTO SELF REFRESH (ASR) ....................................................................................................................... 132

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 133

SRT vs. ASR ............................................................................................................................................... 133

DYNAMIC ODT ......................................................................................................................................... 133

Mode Register 3 (MR3) ................................................................................................................................... 134

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 134

MPR Functional Description ...................................................................................................................... 135

MPR Register Address Definitions and Bursting Order ................................................................................. 136

MPR Read Predefined Pattern .................................................................................................................... 142

MODE REGISTER SET (MRS) Command ........................................................................................................ 142

ZQ CALIBRATION Operation ......................................................................................................................... 143

ACTIVATE Operation ..................................................................................................................................... 144

READ Operation ............................................................................................................................................ 146

WRITE Operation .......................................................................................................................................... 157

DQ Input Timing ....................................................................................................................................... 165

PRECHARGE Operation ................................................................................................................................. 167

SELF REFRESH Operation .............................................................................................................................. 167

Extended Temperature Usage ........................................................................................................................ 168

Power-Down Mode ........................................................................................................................................ 170

RESET Operation ........................................................................................................................................... 178

On-Die Termination (ODT) ............................................................................................................................ 180

Functional Representation of ODT ............................................................................................................. 180

Nominal ODT ............................................................................................................................................ 180

Dynamic ODT ............................................................................................................................................... 182

CCMTD-1725822587-10208

automotive_4gb_ddr3l_v00h.pdf - Rev. F 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

4Gb: x8, x16 Automotive DDR3L SDRAM

Description

Dynamic ODT Special Use Case ................................................................................................................. 182

Functional Description .............................................................................................................................. 182

Synchronous ODT Mode ................................................................................................................................ 188

ODT Latency and Posted ODT .................................................................................................................... 188

Timing Parameters .................................................................................................................................... 188

ODT Off During READs .............................................................................................................................. 191

Asynchronous ODT Mode .............................................................................................................................. 193

Synchronous to Asynchronous ODT Mode Transition (Power-Down Entry) .................................................. 195

Asynchronous to Synchronous ODT Mode Transition (Power-Down Exit) ........................................................ 197

Asynchronous to Synchronous ODT Mode Transition (Short CKE Pulse) ...................................................... 199

Revision History ............................................................................................................................................ 201

Rev. F – 02/18 ............................................................................................................................................ 201

Rev. E – 12/17 ............................................................................................................................................ 201

Rev. D – 02/17 ............................................................................................................................................ 201

Rev. C – 05/16 ............................................................................................................................................ 201

Rev. B – 04/16 ............................................................................................................................................ 201

Rev. A – 12/15 ............................................................................................................................................ 201

CCMTD-1725822587-10208

automotive_4gb_ddr3l_v00h.pdf - Rev. F 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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