Based MCPs
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SPANSION |
| Parts packaging code | BGA |
| package instruction | LFBGA, BGA84,10X12,32 |
| Contacts | 84 |
| Reach Compliance Code | compli |
| Is Samacsys | N |
| Maximum access time | 65 ns |
| Other features | PSRAM IS ORGANIZED AS 4M X 16 |
| JESD-30 code | R-PBGA-B84 |
| length | 11.6 mm |
| memory density | 268435456 bi |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 16 |
| Mixed memory types | FLASH+PSRAM |
| Number of functions | 1 |
| Number of terminals | 84 |
| word count | 16777216 words |
| character code | 16000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 16MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA84,10X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8 mm |
| Base Number Matches | 1 |
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