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STM32L162VDY6XTR

Description
ARM Microcontrollers - MCU Ultra-low-power ARM Cortex-M3 MCU with 384 Kbytes Flash, 32 MHz CPU, LCD, USB, 2xOp-amp, AES
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,120 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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STM32L162VDY6XTR Overview

ARM Microcontrollers - MCU Ultra-low-power ARM Cortex-M3 MCU with 384 Kbytes Flash, 32 MHz CPU, LCD, USB, 2xOp-amp, AES

STM32L162VDY6XTR Parametric

Parameter NameAttribute value
Brand NameSTMicroelectronics
Is it Rohs certified?conform to
package instructionVFBGA, BGA104,9X12,16
Reach Compliance Codecompliant
ECCN code5A992.C
Factory Lead Time14 weeks
Has ADCYES
Address bus width
bit size32
boundary scanYES
CPU seriesCORTEX-M3
maximum clock frequency24 MHz
DAC channelYES
DMA channelYES
External data bus width
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PBGA-B104
length5.094 mm
low power modeYES
Number of DMA channels12
Number of external interrupt devices16
Number of I/O lines83
Number of terminals104
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA104,9X12,16
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification statusNot Qualified
RAM (bytes)81920
RAM (number of words)40960
rom(word)393216
ROM programmabilityFLASH
Maximum seat height0.585 mm
speed32 MHz
Maximum slew rate12.3 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
width4.095 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1
STM32L162VD-X
Ultra-low-power 32-bit MCU Arm
®
-based Cortex
®
-M3 with 384KB
Flash, 80KB SRAM, 16KB EEPROM, LCD, USB, ADC, DAC, AES
Datasheet
-
production data
Features
Ultra-low-power platform
– 1.65 V to 3.6 V power supply
-40 °C to 105 °C
temperature range
– 290 nA Standby mode (3 wakeup pins)
– 1.11 µA Standby mode + RTC
– 560 nA Stop mode (16 wakeup lines)
– 1.4 µA Stop mode + RTC
– 11 µA Low-power run mode down to 4.6 µA
in Low-power sleep mode
– 195 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
AES 128-bit encryption hardware accelerator
Core: Arm
®
Cortex
®
-M3 32-bit CPU
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
Up to 23 capacitive sensing channels
CRC calculation unit, 96-bit unique ID
Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz oscillator factory trimmed
RC(+/-1%) with PLL option
– Internal low-power 37 kHz oscillator
– Internal multispeed low-power 65 kHz to
4.2 MHz oscillator
– PLL for CPU clock and USB (48 MHz)
Pre-programmed bootloader
– USB and USART supported
LQFP100 (14 × 14 mm)
WLCSP104
(0.4 mm pitch)
Up to 116 fast I/Os (102 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
Memories
– 384 Kbytes of Flash memory with ECC
(with 2 banks of 192 Kbytes enabling RWW
capability)
– 80 Kbytes of RAM
– 16 Kbytes of true EEPROM with ECC
– 128-byte backup register
LCD driver up to 8x40 segments, contrast
adjustment, blinking mode, step-up converter
Rich analog peripherals (down to 1.8 V)
– 2x operational amplifiers
– 12-bit ADC 1 Msps up to 40 channels
– 12-bit DAC 2 ch with output buffers
– 2x ultra-low-power comparators
(window mode and wakeup capability)
DMA controller 12x channels
11x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 5x USARTs
– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
– 2x I
2
Cs (SMBus/PMBus)
11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels, 2x 16-bit basic timers,
2x watchdog timers (independent and window)
Development support: serial wire debug, JTAG
and trace
December 2017
This is information on a product in full production.
DocID027268 Rev 4
1/120
www.st.com

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Description ARM Microcontrollers - MCU Ultra-low-power ARM Cortex-M3 MCU with 384 Kbytes Flash, 32 MHz CPU, LCD, USB, 2xOp-amp, AES ARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU ARM Microcontrollers - MCU 32B Cortex-M3 LCD 384Kb Flsh 32MHz CPU ARM Microcontrollers - MCU 32B Cortex-M3 LCD 384Kb Flsh 32MHz CPU ARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU
Brand Name STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
package instruction VFBGA, BGA104,9X12,16 VFBGA, BGA132,12X12,20 VFBGA, BGA64,8X8,16 VFBGA, BGA132,12X12,20 LFQFP, QFP100,.63SQ,20
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code 5A992.C 5A992.C 5A992.C 5A992.C 5A992.C
Factory Lead Time 14 weeks 14 weeks 14 weeks 14 weeks 14 weeks
Has ADC YES YES YES YES YES
Address bus width - 26 26 26 26
bit size 32 32 32 32 32
CPU series CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3 CORTEX-M3
maximum clock frequency 24 MHz 24 MHz 24 MHz 24 MHz 24 MHz
DMA channel YES YES YES YES YES
External data bus width - 16 16 16 16
length 5.094 mm 7 mm 4.911 mm 7 mm 14 mm
Number of I/O lines 83 109 51 109 83
Number of terminals 104 132 64 132 100
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA VFBGA VFBGA LFQFP
Encapsulate equivalent code BGA104,9X12,16 BGA132,12X12,20 BGA64,8X8,16 BGA132,12X12,20 QFP100,.63SQ,20
Package shape RECTANGULAR SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 81920 49152 49152 49152 49152
rom(word) 393216 393216 393216 393216 393216
ROM programmability FLASH FLASH FLASH FLASH FLASH
speed 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
Maximum slew rate 12.3 mA 12.3 mA 12.3 mA 12.3 mA 12.3 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V 1.65 V 1.8 V
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL GULL WING
Terminal pitch 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM QUAD
width 4.095 mm 7 mm 4.539 mm 7 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
JESD-30 code R-PBGA-B104 - S-PBGA-B64 - S-PQFP-G100
Maker - STMicroelectronics - STMicroelectronics STMicroelectronics
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 2/3.3 V 2/3.3 V 1.8/3.3 V 2/3.3 V
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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