STM32L162QDH6 datasheet, PDF - EEWORLD Datasheet

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STM32L162QDH6: DescriptionARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，120 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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ARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU

STM32L162QDH6 Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Maker	STMicroelectronics
package instruction	VFBGA, BGA132,12X12,20
Reach Compliance Code	compliant
ECCN code	5A992.C
Factory Lead Time	14 weeks
Has ADC	YES
Address bus width	26
bit size	32
CPU series	CORTEX-M3
maximum clock frequency	24 MHz
DMA channel	YES
External data bus width	16
length	7 mm
Number of I/O lines	109
Number of terminals	132
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA132,12X12,20
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	49152
rom(word)	393216
ROM programmability	FLASH
speed	32 MHz
Maximum slew rate	12.3 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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STM32L162VD-X

Ultra-low-power 32-bit MCU Arm

-based Cortex

-M3 with 384KB

Flash, 80KB SRAM, 16KB EEPROM, LCD, USB, ADC, DAC, AES

Datasheet

production data

Features

•

Ultra-low-power platform

– 1.65 V to 3.6 V power supply

–

-40 °C to 105 °C

temperature range

– 290 nA Standby mode (3 wakeup pins)

– 1.11 µA Standby mode + RTC

– 560 nA Stop mode (16 wakeup lines)

– 1.4 µA Stop mode + RTC

– 11 µA Low-power run mode down to 4.6 µA

in Low-power sleep mode

– 195 µA/MHz Run mode

– 10 nA ultra-low I/O leakage

– 8 µs wakeup time

•

AES 128-bit encryption hardware accelerator

•

Core: Arm

Cortex

-M3 32-bit CPU

– From 32 kHz up to 32 MHz max

– 1.25 DMIPS/MHz (Dhrystone 2.1)

– Memory protection unit

•

Up to 23 capacitive sensing channels

•

CRC calculation unit, 96-bit unique ID

•

Reset and supply management

– Low-power, ultrasafe BOR (brownout reset)

with 5 selectable thresholds

– Ultra-low-power POR/PDR

– Programmable voltage detector (PVD)

•

Clock sources

– 1 to 24 MHz crystal oscillator

– 32 kHz oscillator for RTC with calibration

– Internal 16 MHz oscillator factory trimmed

RC(+/-1%) with PLL option

– Internal low-power 37 kHz oscillator

– Internal multispeed low-power 65 kHz to

4.2 MHz oscillator

– PLL for CPU clock and USB (48 MHz)

•

Pre-programmed bootloader

– USB and USART supported

LQFP100 (14 × 14 mm)

WLCSP104

(0.4 mm pitch)

•

Up to 116 fast I/Os (102 I/Os 5V tolerant), all

mappable on 16 external interrupt vectors

•

Memories

– 384 Kbytes of Flash memory with ECC

(with 2 banks of 192 Kbytes enabling RWW

capability)

– 80 Kbytes of RAM

– 16 Kbytes of true EEPROM with ECC

– 128-byte backup register

•

LCD driver up to 8x40 segments, contrast

adjustment, blinking mode, step-up converter

•

Rich analog peripherals (down to 1.8 V)

– 2x operational amplifiers

– 12-bit ADC 1 Msps up to 40 channels

– 12-bit DAC 2 ch with output buffers

– 2x ultra-low-power comparators

(window mode and wakeup capability)

•

DMA controller 12x channels

•

11x peripheral communication interfaces

– 1x USB 2.0 (internal 48 MHz PLL)

– 5x USARTs

– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)

– 2x I

Cs (SMBus/PMBus)

•

11x timers: 1x 32-bit, 6x 16-bit with up to 4

IC/OC/PWM channels, 2x 16-bit basic timers,

2x watchdog timers (independent and window)

•

Development support: serial wire debug, JTAG

and trace

December 2017

This is information on a product in full production.

DocID027268 Rev 4

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www.st.com

Contents

STM32L162VD-X

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1

2.2

Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.2.1

2.2.2

2.2.3

2.2.4

Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Shared peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Common system strategy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.1

3.2

3.3

Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Arm

Cortex

-M3 core with MPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.3.1

3.3.2

3.3.3

3.3.4

Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.4

3.5

3.6

3.7

3.8

3.9

3.10

Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 22

GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . . 22

Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DMA (direct memory access) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

LCD (liquid crystal display) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

ADC (analog-to-digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.10.1

3.10.2

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Internal voltage reference (V

REFINT

) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.11

3.12

3.13

3.14

3.15

DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Operational amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 26

System configuration controller and routing interface . . . . . . . . . . . . . . . 26

Touch sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

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Contents

3.16

3.17

AES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.17.1

3.17.2

3.17.3

3.17.4

3.17.5

General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and

TIM11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Basic timers (TIM6 and TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Universal synchronous/asynchronous receiver transmitter (USART) . . 29

Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

3.18

Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.18.1

3.18.2

3.18.3

3.18.4

3.18.5

3.19

3.20

CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 29

Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.20.1

3.20.2

Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 30

Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

6.1

Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Optional LCD power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

6.2

6.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

6.3.1

6.3.2

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Embedded reset and power control block characteristics . . . . . . . . . . . 55

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Contents

6.3.3

6.3.4

6.3.5

6.3.6

6.3.7

6.3.8

6.3.9

6.3.10

6.3.11

6.3.12

6.3.13

6.3.14

6.3.15

6.3.16

6.3.17

6.3.18

6.3.19

6.3.20

6.3.21

6.3.22

STM32L162VD-X

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

LCD controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

7.1

7.2

7.3

LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package

information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

WLCSP104, 0.4 mm pitch wafer level chip scale package

information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115

7.3.1

Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

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List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Table 45.

Table 46.

Ultra-low-power STM32L162VD-X device features

and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Functionalities depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . 14

CPU frequency range depending on dynamic voltage scaling . . . . . . . . . . . . . . . . . . . . . . 15

Functionalities depending on the working mode (from Run/active down to

standby) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

STM32L162VD-X pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Alternate function input/output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 55

Embedded internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Current consumption in Run mode, code with data processing running from Flash. . . . . . 59

Current consumption in Run mode, code with data processing running from RAM . . . . . . 60

Current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Current consumption in Low-power run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Current consumption in Low-power sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 64

Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 66

Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

LSE oscillator characteristics (f

LSE

= 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

MSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Flash memory and data EEPROM characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Flash memory and data EEPROM endurance and retention . . . . . . . . . . . . . . . . . . . . . . . 80

EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

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STM32L162QDH6 Related Products

	STM32L162QDH6	STM32L162RDY6TR	STM32L162QDH6DTR	STM32L162VDT6	STM32L162VDY6XTR
Description	ARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU	ARM Microcontrollers - MCU 32B Cortex-M3 LCD 384Kb Flsh 32MHz CPU	ARM Microcontrollers - MCU 32B Cortex-M3 LCD 384Kb Flsh 32MHz CPU	ARM Microcontrollers - MCU STM32L16 Low Power M3 384kB 32MHz MCU	ARM Microcontrollers - MCU Ultra-low-power ARM Cortex-M3 MCU with 384 Kbytes Flash, 32 MHz CPU, LCD, USB, 2xOp-amp, AES
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
package instruction	VFBGA, BGA132,12X12,20	VFBGA, BGA64,8X8,16	VFBGA, BGA132,12X12,20	LFQFP, QFP100,.63SQ,20	VFBGA, BGA104,9X12,16
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	5A992.C	5A992.C	5A992.C	5A992.C	5A992.C
Factory Lead Time	14 weeks	14 weeks	14 weeks	14 weeks	14 weeks
Has ADC	YES	YES	YES	YES	YES
Address bus width	26	26	26	26	-
bit size	32	32	32	32	32
CPU series	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3
maximum clock frequency	24 MHz	24 MHz	24 MHz	24 MHz	24 MHz
DMA channel	YES	YES	YES	YES	YES
External data bus width	16	16	16	16	-
length	7 mm	4.911 mm	7 mm	14 mm	5.094 mm
Number of I/O lines	109	51	109	83	83
Number of terminals	132	64	132	100	104
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	LFQFP	VFBGA
Encapsulate equivalent code	BGA132,12X12,20	BGA64,8X8,16	BGA132,12X12,20	QFP100,.63SQ,20	BGA104,9X12,16
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	49152	49152	49152	49152	81920
rom(word)	393216	393216	393216	393216	393216
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH
speed	32 MHz	32 MHz	32 MHz	32 MHz	32 MHz
Maximum slew rate	12.3 mA	12.3 mA	12.3 mA	12.3 mA	12.3 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.65 V	1.8 V	1.8 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	GULL WING	BALL
Terminal pitch	0.5 mm	0.4 mm	0.5 mm	0.5 mm	0.4 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	QUAD	BOTTOM
width	7 mm	4.539 mm	7 mm	14 mm	4.095 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	2/3.3 V	2/3.3 V	1.8/3.3 V	2/3.3 V	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
JESD-30 code	-	S-PBGA-B64	-	S-PQFP-G100	R-PBGA-B104

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