PIC18LF4515T-I/ML datasheet, PDF

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PIC18LF4515T-I/ML: Description8-bit microcontroller-MCU 48KB 3968 RAM 36I/O; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，377 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC18LF4515T-I/ML Overview

8-bit microcontroller-MCU 48KB 3968 RAM 36I/O

PIC18LF4515T-I/ML Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	QFN
package instruction	8 X 8 MM, PLASTIC, MO-220, QFN-44
Contacts	44
Reach Compliance Code	compliant
Has ADC	YES
Other features	OPERATES AT 2V MINIMUM SUPPLY @ 4 MHZ
Address bus width
bit size	8
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQCC-N44
JESD-609 code	e3
length	8 mm
Humidity sensitivity level	1
Number of I/O lines	36
Number of terminals	44
On-chip program ROM width	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
RAM (bytes)	3968
rom(word)	24576
ROM programmability	FLASH
Maximum seat height	1 mm
speed	40 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.2 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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PIC18F2X1X/4X1X

28/40/44-Pin Flash Microcontrollers with

10-Bit A/D and nanoWatt Technology

Power-Managed Modes:

•

Run: CPU On, Peripherals On

Idle: CPU Off, Peripherals On

Sleep: CPU Off, Peripherals Off

Idle mode Currents Down to 3.0

μA

Typical

Sleep mode Currents Down to 20 nA Typical

Timer1 Oscillator: 1.8

μA,

32 kHz, 2V

Watchdog Timer: 2.1

μA

Two-Speed Oscillator Start-up

Flexible Oscillator Structure:

• Four Crystal modes, Up to 40 MHz

• 4x Phase Lock Loop (PLL) – Available for Crystal

and Internal Oscillators

• Two External RC modes, Up to 4 MHz

• Two External Clock modes, Up to 40 MHz

• Internal Oscillator Block:

- 8 user-selectable frequencies, from 31 kHz to

8 MHz

- Provides a complete range of clock speeds

from 31 kHz to 32 MHz when used with PLL

- User-tunable to compensate for frequency drift

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor:

- Allows for safe shutdown if peripheral clock stops

Peripheral Highlights:

• High-Current Sink/Source 25 mA/25 mA

• Up to 2 Capture/Compare/PWM (CCP) modules,

One with Auto-Shutdown (28-pin devices)

• Enhanced Capture/Compare/PWM (ECCP)

module (40/44-pin devices only):

- One, two or four PWM outputs

- Selectable polarity

- Programmable dead time

- Auto-shutdown and auto-restart

• Master Synchronous Serial Port (MSSP) module

Supporting 3-Wire SPI (all 4 modes) and I

C™

Master and Slave modes

• Enhanced Addressable USART module:

- Supports RS-485, RS-232 and LIN 1.2

- RS-232 operation using internal oscillator

block (no external crystal required)

- Auto-wake-up on Start bit

- Auto-Baud Detect

• 10-Bit, Up to 13-Channel Analog-to-Digital

Converter module (A/D):

- Auto-acquisition capability

- Conversion available during Sleep

• Dual Analog Comparators with Input Multiplexing

• Programmable 16-Level High/Low-Voltage

Detection (HLVD) module:

- Supports interrupt on High/Low-Voltage Detection

Special Microcontroller Features:

• C Compiler Optimized Architecture:

- Optional extended instruction set designed to

optimize re-entrant code

• 100,000 Erase/Write Cycle Flash Program

Memory Typical

• Three Programmable External Interrupts

• Four Input Change Interrupts

• Priority Levels for Interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT):

- Programmable period from 4 ms to 131s

• Single-Supply 5V In-Circuit Serial

Programming™ (ICSP™) via Two Pins

• In-Circuit Debug (ICD) via Two Pins

• Wide Operating Voltage Range: 2.0V to 5.5V

• Programmable Brown-out Reset (BOR) with

Software Enable Option

2009 Microchip Technology Inc.

DS39636D-page 3

PIC18F2X1X/4X1X

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 9

2.0 Oscillator Configurations ............................................................................................................................................................ 25

3.0 Power-Managed Modes ............................................................................................................................................................. 35

4.0 Reset .......................................................................................................................................................................................... 43

5.0 Memory Organization ................................................................................................................................................................. 55

6.0 Flash Program Memory.............................................................................................................................................................. 77

7.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 81

8.0 Interrupts .................................................................................................................................................................................... 83

9.0 I/O Ports ..................................................................................................................................................................................... 97

10.0 Timer0 Module ......................................................................................................................................................................... 115

11.0 Timer1 Module ......................................................................................................................................................................... 119

12.0 Timer2 Module ......................................................................................................................................................................... 125

13.0 Timer3 Module ......................................................................................................................................................................... 127

14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 131

15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 139

16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 153

17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 193

18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 213

19.0 Comparator Module.................................................................................................................................................................. 223

20.0 Comparator Voltage Reference Module................................................................................................................................... 229

21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 233

22.0 Special Features of the CPU.................................................................................................................................................... 239

23.0 Instruction Set Summary .......................................................................................................................................................... 259

24.0 Development Support............................................................................................................................................................... 309

25.0 Electrical Characteristics .......................................................................................................................................................... 313

26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 351

27.0 Packaging Information.............................................................................................................................................................. 353

Appendix A: Revision History............................................................................................................................................................. 361

Appendix B: Device Differences ........................................................................................................................................................ 361

Appendix C: Conversion Considerations ........................................................................................................................................... 362

Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 362

Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 363

Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 363

Index ................................................................................................................................................................................................. 365

The Microchip Web Site ..................................................................................................................................................................... 375

Customer Change Notification Service .............................................................................................................................................. 375

Customer Support .............................................................................................................................................................................. 375

Reader Response .............................................................................................................................................................................. 376

PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 377

2009 Microchip Technology Inc.

DS39636D-page 7

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