TECHNICAL DATA SHEET
EHA-PA1AN1-R03
Mini-Harvester Thermal Energy Generator
Solid to Air
TYPICAL PERFORMANCE VALUES
AC Resistance @27°C (Ω):
Max Hot Side Temp (C):
Thermal R
Base – Amb
@ 0mph (C/W)
Thermal R
Base – Amb
@ 3mph (C/W)
Typical Load (Ω)
Optimal Load (Ω)
1.1
85°C
135
57
(1.2-5)
1.5Ω
MECHANICAL CHARACTERISTICS
ORDERING OPTIONS
Model Number
EHA-PA1AN1-R03
Description
Mini-Harvester Energy Generator Assembly
Solid to Air
PRODUCT FEATURES
Low cost, small package thermal energy harvester.
Alternative for replaceable primary cell batteries.
Compatible with vertical and horizontal surfaces.
Compatible with commercially available power
management electronics.
Non-invasive installation.
Anodized for corrosion protection.
Maximum hot side temperature of 85°C.
For customer support or general questions please contact a local office or visit our website at
www.marlow.com.
DOC # 102-0509 REV 1 - PAGE 1 OF 2
EHA‐PA1AN1‐R03 Mini‐Harvester
Open Circuit Voltage (V)
EHA‐PA1AN1‐R03 Mini‐Harvester
Matched Load Resistance (1.5 Ohms) ‐ 0‐3 MPH Air Flow
Ambient Temp ≈25°C
0.4
TYPICAL PERFORMANCE CURVES
Gross Power (W)
Matched Load Resistance (1.5 Ohms) ‐ 0‐3 MPH Air Flow
Ambient Temp ≈25°C
0.02
3 mph
0.015
0.01
0.005
0
25
35
45
3 mph
0.3
0.2
0.1
0
25
35
45
0 mph
T
hot
(˚C)
55
65
75
85
0 mph
T
hot
(˚C)
55
65
75
85
EHA‐PA1AN1‐R03 Mini‐Harvester
Matched Load Resistance (1.5 Ohms) ‐ 0‐3 MPH Air Flow
Ambient Temp ≈25°C
Matched Load Voltage (V)
0.2
0.16
0.12
0.08
0.04
0
25
35
45
55
65
75
85
3 mph
Air Flow (MPH)
Hot Side Temperature (°C)
Cold Side Temperature (°C)
Gross Power (W)
Open Circuit Voltage (V)
Matched Load Voltage (V)
0
85
25
0.003
0.15
0.08
3
85
25
0.018
0.35
0.16
0
55
25
0.0005
0.075
0.038
3
55
25
0.005
0.175
0.1
0 mph
T
hot
(˚C)
Power Output
Power from the harvester is generated by converting heat energy into electrical energy. The amount of electrical power produced is
a function of the temperature differential between source and ambient, as indicated by the performance curves. Voltage boost and
power conditioning electronics and reference designs are commercially available from many semiconductor manufacturers. These
include the Texas Instruments BQ25504, EM Microelectronic EM8900, and Linear Technologies LTC3107, LTC3108, LTC3109.
Installation
Recommended mounting methods: Remove insulation and any remaining debris from the surface to allow effective thermal contact.
Assembly should be adhered to surface with a thermally conductive adhesive or epoxy suited for the application environment. Bond
line should be minimized to reduce thermal interface resistance.
Operation Cautions
For maximum reliability, ambient temperatures are limited between -40°C to 60°C during continuous operation. Maximum hot side
temperatures are restricted to 85°C.
CONTACT US:
For customer support or general questions please contact a local office below or visit our website at
www.marlow.com.
Marlow Industries, Inc.
10451 Vista Park Road
Dallas Texas 75238-1645
214-340-4900 (tel)
214-341-5212 (fax)
877-627-5691 (tech support)
www.marlow.com
II-VI Japan Inc.
WBG Marive East 17F
2-6 Nakase, Mihama-ku
Chiba-Shi, Chiba 261-7117
Japan
81 43 297 2693 (tel)
81 43 297 3003 (fax)
center@ii-vi.co.jp
www.ii-vi.co.jp
Marlow Industries Europe GmbH
Brunnenweg 19-21
64331 Weiterstadt
Germany
Tel.: +49 (0) 6150 5439 - 403
Fax: +49 (0) 6150 5439 - 400
info@marlow-europe.eu
II-VI Singapore Pte., Ltd.
Blk. 5012, Techplace II
#04-07 & 05-07/12, Ang Mo Kio Ave. 5
Singapore 569876
(65) 6481 8215 (tel)
(65) 6481 8702 (fax)
info@ii-vi.com.sg
www.ii-vi.com.sg
Marlow Industries China, II-VI
Technologies Beijing
A subsidiary of II-VI Incorporated
Rm 202, 1# Lize 2nd Middle Road
Wangjing, Chaoyang District
Beijing 100102 China
010-64398226 ext 105 (tel)
010-64399315 (fax)
info@iivibj.com
DOC # 102-0509 REV 1 - PAGE 2 OF 2
PCB Design
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