EEWORLDEEWORLDEEWORLD

Part Number

Search

MCR03EZPFX1183

Description
RES SMD 118K OHM 1% 1/10W 0603
CategoryPassive components    The resistor   
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
Download Datasheet Parametric View All

MCR03EZPFX1183 Overview

RES SMD 118K OHM 1% 1/10W 0603

MCR03EZPFX1183 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
structureRectangular
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length1.6 mm
Package formSMT
Package width0.8 mm
method of packingTR, Paper, 7 Inch
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineTS 16949
resistance118000 Ω
Resistor typeFIXED RESISTOR
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V
Thick film chip resistors
MCR series
Datasheet
Features
1)Full line up from ultra small size (01005) to 2512 with jumper type.
2)High reliability metal glazed thick film.
3)ROHM resistors have obtained ISO9001/ISO/TS16949 certification.
Size
Part No.
MCR004
MCR006
MCR01
MCR03
MCR10
MCR18
MCR25
MCR50
MCR100
(mm)
0402
0603
1005
1608
2012
3216
3225
5025
6432
(inch)
01005
0201
0402
0603
0805
1206
1210
2010
2512
Type code
QLP
YLP
MZP
EZP
EZP
EZP
JZH
JZH
JZH
Packaging
specifications
Paper tape(2mm Pitch)
Paper tape(2mm Pitch)
Paper tape(2mm Pitch)
Paper tape(4mm Pitch)
Paper tape(4mm Pitch)
Paper tape(4mm Pitch)
Embossed tape(4mm Pitch)
Embossed tape(4mm Pitch)
Embossed tape(4mm Pitch)
Quantity / Reel
20,000
15,000
10,000
5,000
5,000
5,000
4,000
4,000
4,000
Automotive
Grade
Available
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Part number description
M C R
Part No.
0 0 4
Size
(mm [inch])
004(0402 [01005])
006(0603 [0201])
01(1005 [0402])
03(1608 [0603])
10(2012 [0805])
18(3216 [1206])
25(3225 [1210])
50(5025 [2010])
100(6432 [2512])
Q L P
Type code
J
Resistance tolerance
D (±0.5%)
F (±1%)
FX (±1%) *Only MCR03EZP
J (±5%) (Including jumper type)
1 0 0
Nominal resistance
Resistance code, 3 or 4 digits.
000 denotes jumper type.
Resistance
Resistance
tolerance
code
D,F
4 digits
J
3 digits
EX.)
1Ω = 1R0 (±5%)
9.1Ω = 9R1 (±5%)
10Ω = 10R0 (±0.5%,±1%)
100 (±5%)
2.2MΩ = 2204 (±0.5%,± 1%)
225 (±5%)
MCR
(Micro chip
resistors)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
1/6
2017.12 - Rev.O
Use of resolver decoding chip AD2S1200
Boss, when using the AD2S1200 chip, supplying 5V analog power and 5V digital power, and pulling CS low to enable, will the EXC pin have a sinusoidal excitation waveform?...
kkiLL33 Microcontroller MCU
GaN goes mobile?
It’s only a matter of time before GaN makes its way into phones. Smartphone makers will need GaN to reach the higher millimeter wave (mmWave) frequencies required for 5G. The challenge is to run GaN a...
btty038 RF/Wirelessly
Is there any MEMS or sensor expert?
Is there any big guy who works on MEMS or sensors? Please take me tothis article. This content is originally created by EEWORLD forum netizen Nie Yongzhong . If you want to reprint or use it for comme...
孽庸冢 DIY/Open Source Hardware
Leakage current and withstand voltage test of low voltage battery products
Leakage current and withstand voltage test of low voltage battery productsBattery-powered products like wristbands, mobile phones, and headphones. Charging is DC5V. How to use leakage current tester a...
QWE4562009 Test/Measurement
i.MX6ULL Embedded Linux Development 1-Preliminary Study on Uboot Transplantation
[i=s]This post was last edited by DDZZ669 on 2021-7-27 23:05[/i]This series of tutorials uses the ARM development board of the i.MX6ULL processor as the experimental basis to learn and record various ...
DDZZ669 ARM Technology
【Synopsys IP Resources】 Comprehensive IP Solutions to Help HPC Chip Development
In the field of chip design, using silicon-proven IP is a proven practice.事实上,这种既能节省时间又能提高质量的复杂片上系统(SoC)开发方法的使用范围越来越广,普及率越来越高。特别是在高速增长的动态细分市场中,基于IP的设计已被证明是一种可以显著缩短开发时间、确保输出更高质量的产品、以及提高工程人员工作效率的手段,便于工程...
arui1999 Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号