9-BIT COMPARATOR
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| Parts packaging code | QFP |
| package instruction | QFF, QFL24,.4SQ |
| Contacts | 24 |
| Reach Compliance Code | compli |
| series | 100S |
| JESD-30 code | S-GQFP-F24 |
| JESD-609 code | e0 |
| length | 9.78 mm |
| Logic integrated circuit type | MAGNITUDE COMPARATOR |
| Number of digits | 9 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | QFF |
| Encapsulate equivalent code | QFL24,.4SQ |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | -4.5 V |
| Maximum supply current (ICC) | 120 mA |
| propagation delay (tpd) | 1.6 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.29 mm |
| surface mount | YES |
| technology | ECL |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 9.78 mm |
| SY100S366FC | SY100S366JCTR | SY100S366JC | SY100S366 | |
|---|---|---|---|---|
| Description | 9-BIT COMPARATOR | 9-BIT COMPARATOR | 9-BIT COMPARATOR | 9-BIT COMPARATOR |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - |
| Maker | Microchip | Microchip | Microchip | - |
| package instruction | QFF, QFL24,.4SQ | PLASTIC, LCC-28 | PLASTIC, LCC-28 | - |
| Reach Compliance Code | compli | _compli | _compli | - |
| series | 100S | 100S | 100S | - |
| JESD-30 code | S-GQFP-F24 | S-PQCC-J28 | S-PQCC-J28 | - |
| JESD-609 code | e0 | e0 | e0 | - |
| Logic integrated circuit type | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | - |
| Number of digits | 9 | 9 | 9 | - |
| Number of functions | 1 | 1 | 1 | - |
| Number of terminals | 24 | 28 | 28 | - |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | - |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | QFF | QCCJ | QCCJ | - |
| Encapsulate equivalent code | QFL24,.4SQ | LDCC28,.5SQ | LDCC28,.5SQ | - |
| Package shape | SQUARE | SQUARE | SQUARE | - |
| Package form | FLATPACK | CHIP CARRIER | CHIP CARRIER | - |
| power supply | -4.5 V | -4.2/-5.5 V | -4.5 V | - |
| propagation delay (tpd) | 1.6 ns | 1.5 ns | 1.5 ns | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| surface mount | YES | YES | YES | - |
| technology | ECL | ECL | ECL | - |
| Temperature level | OTHER | COMMERCIAL EXTENDED | OTHER | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | - |
| Terminal form | FLAT | J BEND | J BEND | - |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - |
| Terminal location | QUAD | QUAD | QUAD | - |
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