9-BIT COMPARATOR
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microchip |
package instruction | PLASTIC, LCC-28 |
Reach Compliance Code | _compli |
Other features | WITH A = B O/P INVERTED |
series | 100S |
JESD-30 code | S-PQCC-J28 |
JESD-609 code | e0 |
length | 11.48 mm |
Logic integrated circuit type | MAGNITUDE COMPARATOR |
Humidity sensitivity level | 1 |
Number of digits | 9 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
Output characteristics | OPEN-EMITTER |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC28,.5SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 240 |
power supply | -4.2/-5.5 V |
propagation delay (tpd) | 1.5 ns |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
surface mount | YES |
technology | ECL |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 11.48 mm |
SY100S366JCTR | SY100S366JC | SY100S366FC | SY100S366 | |
---|---|---|---|---|
Description | 9-BIT COMPARATOR | 9-BIT COMPARATOR | 9-BIT COMPARATOR | 9-BIT COMPARATOR |
Is it Rohs certified? | incompatible | incompatible | incompatible | - |
Maker | Microchip | Microchip | Microchip | - |
package instruction | PLASTIC, LCC-28 | PLASTIC, LCC-28 | QFF, QFL24,.4SQ | - |
Reach Compliance Code | _compli | _compli | compli | - |
series | 100S | 100S | 100S | - |
JESD-30 code | S-PQCC-J28 | S-PQCC-J28 | S-GQFP-F24 | - |
JESD-609 code | e0 | e0 | e0 | - |
Logic integrated circuit type | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | - |
Number of digits | 9 | 9 | 9 | - |
Number of functions | 1 | 1 | 1 | - |
Number of terminals | 28 | 28 | 24 | - |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - |
encapsulated code | QCCJ | QCCJ | QFF | - |
Encapsulate equivalent code | LDCC28,.5SQ | LDCC28,.5SQ | QFL24,.4SQ | - |
Package shape | SQUARE | SQUARE | SQUARE | - |
Package form | CHIP CARRIER | CHIP CARRIER | FLATPACK | - |
power supply | -4.2/-5.5 V | -4.5 V | -4.5 V | - |
propagation delay (tpd) | 1.5 ns | 1.5 ns | 1.6 ns | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | - |
surface mount | YES | YES | YES | - |
technology | ECL | ECL | ECL | - |
Temperature level | COMMERCIAL EXTENDED | OTHER | OTHER | - |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | J BEND | J BEND | FLAT | - |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - |
Terminal location | QUAD | QUAD | QUAD | - |