LPC4310FET100,551 datasheet, PDF

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LPC4310FET100,551: DescriptionIC MCU 32BIT ROMLESS 100TFBGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size746KB，2 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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LPC4310FET100,551 Overview

IC MCU 32BIT ROMLESS 100TFBGA

LPC4310FET100,551 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	BGA
package instruction	TFBGA, BGA100,10X10,32
Contacts	100
Manufacturer packaging code	SOT926-1
Reach Compliance Code	compliant
ECCN code	EAR99
Has ADC	YES
Address bus width	24
bit size	32
CPU series	CORTEX-M4
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	YES
External data bus width	32
JESD-30 code	S-PBGA-B100
JESD-609 code	e1
length	9 mm
Humidity sensitivity level	3
Number of I/O lines	49
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA100,10X10,32
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Certification status	Not Qualified
RAM (bytes)	172032
rom(word)	0
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	180 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.2 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Description	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	IC MCU 32BIT 1MB FLASH 256LBGA	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT 512KB FLASH 256LBGA	IC MCU 32BIT ROMLESS 256LBGA
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA100,10X10,32	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40
Contacts	100	256	256	256	256	256	256	256
Manufacturer packaging code	SOT926-1	SOT740-2	SOT740-2	SOT740-2	SOT740-2	SOT740-2	SOT740-2	SOT740-2
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES
Address bus width	24	24	24	24	24	24	24	24
bit size	32	32	32	32	32	32	32	32
CPU series	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
DAC channel	YES	YES	YES	YES	YES	YES	YES	YES
DMA channel	YES	YES	YES	YES	YES	YES	YES	YES
External data bus width	32	32	32	32	32	32	32	32
JESD-30 code	S-PBGA-B100	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609 code	e1	e1	e1	e1	e1	e1	e1	e1
length	9 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of I/O lines	49	164	164	164	164	164	164	164
Number of terminals	100	256	256	256	256	256	256	256
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Encapsulate equivalent code	BGA100,10X10,32	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	172032	139264	139264	139264	139264	139264	139264	270336
rom(word)	-	524288	524288	1048576	1048576	524288	524288	-
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	1.55 mm	1.55 mm	1.55 mm	1.55 mm	1.55 mm	1.55 mm	1.55 mm
speed	180 MHz	204 MHz	204 MHz	204 MHz	204 MHz	204 MHz	204 MHz	180 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	9 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	-	1	1	1	1	1	1	1

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