|
LPC4333JET256,551 |
LPC4333FET256,551 |
LPC4337JET256,551 |
LPC4337FET256,551 |
LPC4353FET256,551 |
LPC4353JET256,551 |
LPC4310FET100,551 |
LPC4330FET256,551 |
Description |
IC MCU 32BIT 512KB FLASH 256LBGA |
IC MCU 32BIT 512KB FLASH 256LBGA |
IC MCU 32BIT 1MB FLASH 256LBGA |
IC MCU 32BIT 1MB FLASH 256LBGA |
IC MCU 32BIT 512KB FLASH 256LBGA |
IC MCU 32BIT 512KB FLASH 256LBGA |
IC MCU 32BIT ROMLESS 100TFBGA |
IC MCU 32BIT ROMLESS 256LBGA |
Brand Name |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
package instruction |
LBGA, BGA256,16X16,40 |
LBGA, BGA256,16X16,40 |
LBGA, BGA256,16X16,40 |
LBGA, BGA256,16X16,40 |
LBGA, BGA256,16X16,40 |
LBGA, BGA256,16X16,40 |
TFBGA, BGA100,10X10,32 |
LBGA, BGA256,16X16,40 |
Contacts |
256 |
256 |
256 |
256 |
256 |
256 |
100 |
256 |
Manufacturer packaging code |
SOT740-2 |
SOT740-2 |
SOT740-2 |
SOT740-2 |
SOT740-2 |
SOT740-2 |
SOT926-1 |
SOT740-2 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
Has ADC |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
Address bus width |
24 |
24 |
24 |
24 |
24 |
24 |
24 |
24 |
bit size |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
CPU series |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
CORTEX-M4 |
maximum clock frequency |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
DAC channel |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
DMA channel |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
External data bus width |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
JESD-30 code |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B256 |
S-PBGA-B100 |
S-PBGA-B256 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
length |
17 mm |
17 mm |
17 mm |
17 mm |
17 mm |
17 mm |
9 mm |
17 mm |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
Number of I/O lines |
164 |
164 |
164 |
164 |
164 |
164 |
49 |
164 |
Number of terminals |
256 |
256 |
256 |
256 |
256 |
256 |
100 |
256 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
YES |
YES |
YES |
NO |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LBGA |
LBGA |
LBGA |
LBGA |
LBGA |
LBGA |
TFBGA |
LBGA |
Encapsulate equivalent code |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA256,16X16,40 |
BGA100,10X10,32 |
BGA256,16X16,40 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, LOW PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
260 |
power supply |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
2.5/3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (bytes) |
139264 |
139264 |
139264 |
139264 |
139264 |
139264 |
172032 |
270336 |
rom(word) |
524288 |
524288 |
1048576 |
1048576 |
524288 |
524288 |
- |
- |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
Maximum seat height |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
1.55 mm |
1.2 mm |
1.55 mm |
speed |
204 MHz |
204 MHz |
204 MHz |
204 MHz |
204 MHz |
204 MHz |
180 MHz |
180 MHz |
Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage |
2.2 V |
2.2 V |
2.2 V |
2.2 V |
2.2 V |
2.2 V |
2.2 V |
2.2 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
0.5 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
width |
17 mm |
17 mm |
17 mm |
17 mm |
17 mm |
17 mm |
9 mm |
17 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
- |
1 |