IC SYNTHESIZER RF DUALBAND 28MLP
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Silicon Laboratories Inc |
Parts packaging code | QFN |
package instruction | HVQCCN, |
Contacts | 28 |
Reach Compliance Code | compliant |
Analog Integrated Circuits - Other Types | PHASE LOCKED LOOP |
JESD-30 code | S-XQCC-N28 |
JESD-609 code | e3 |
length | 5 mm |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 0.9 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 5 mm |
SI4133-D-GMR | SI4113-D-GMR | SI4122-D-GMR | SI4113-D-GT | SI4112-D-GTR | SI4123-D-GT | SI4122-D-GM | SI4122-D-GT | |
---|---|---|---|---|---|---|---|---|
Description | IC SYNTHESIZER RF DUALBAND 28MLP | IC SYNTHESIZER RF-ONLY 28MLP | IC SYNTH RF2/IF SNGL-BAND 28MLP | IC SYNTHESIZER RF1/RF2 24TSSOP | IC SYNTHESIZER IF ONLY 24TSSOP | IC SYNTHESIZER RF1/IF 24TSSOP | IC SYNTH RF2/IF SNGL-BAND 28MLP | IC SYNTHESIZER RF2/IF 24TSSOP |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
Parts packaging code | QFN | QFN | QFN | TSSOP | TSSOP | TSSOP | QFN | TSSOP |
package instruction | HVQCCN, | HVQCCN, | HVQCCN, | TSSOP, | TSSOP, | TSSOP, | HVQCCN, | TSSOP, |
Contacts | 28 | 28 | 28 | 24 | 24 | 24 | 28 | 24 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Analog Integrated Circuits - Other Types | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP |
JESD-30 code | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | S-XQCC-N28 | R-PDSO-G24 |
length | 5 mm | 5 mm | 5 mm | 7.8 mm | 7.8 mm | 7.8 mm | 5 mm | 7.8 mm |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 24 | 24 | 24 | 28 | 24 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
encapsulated code | HVQCCN | HVQCCN | HVQCCN | TSSOP | TSSOP | TSSOP | HVQCCN | TSSOP |
Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 0.9 mm | 0.9 mm | 0.9 mm | 1.2 mm | 1.2 mm | 1.2 mm | 0.9 mm | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
width | 5 mm | 5 mm | 5 mm | 4.4 mm | 4.4 mm | 4.4 mm | 5 mm | 4.4 mm |
JESD-609 code | e3 | e3 | e3 | - | e3 | e4 | - | e4 |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Silver (Ag) | - | Silver (Ag) |