A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[i=s]This post was last edited by RCSN on 2021-7-12 18:00[/i]For details of DIY projects, see this postThe previous host computer UI theme was really ugly, so we optimized the UI and created a wireles...
[b][size=4] [/size][/b] [b][size=4] As the title: Summarizes the common problems in LoRa development and shares them. Welcome to download and exchange :). [/size][/b] [b][size=4] [/size][/b]Common pro...
[font=微软雅黑][size=4]Gallium nitride and graphene, which were hyped up a few years ago, are surprisingly similar in popularity. They are both new materials that promote the rapid development of related ...
I need to use 28335 to store data (transfer function array), and I need to use this data multiple times after power-on, or even modify it and store it. So I have the following thoughts:
1. Store it in...
The circuit I designed using the BL9582B design manual is as follows:
The difference between the picture and the manual is: an optocoupler is added, which may affect the smoothness of the PWM. There s...
This block coordinates interlock requests between the various
To prevent a "deadlock" between robots, the robots output an interlock request and wait for confirmation before entering an interl...[Details]
The serial port of 51 chip can work in several different working modes, and its working mode is set by using SCON register. The specific definition of each bit is as follows:
SM0 SM1 ...[Details]
For image surveillance systems, users often put forward such functional requirements: they hope to be able to monitor distant objects. These objects may be distributed in suburbs, deep mountains, was...[Details]
With the rapid development of the new energy industry, power batteries are the core components of new energy vehicles. New energy spontaneous combustion accidents caused by battery safety issues se...[Details]
Beijing, China - August 17, 2023 -
Creative Technology (Singapore) recently announced a strategic partnership with xMEMS Labs,
a pioneer in solid-state fidelity, to bring a new era of excel...[Details]
Professor Lu Yan of the University of Macau invited me to speak at the 3rd Chinese Chip Design Technology Symposium and congratulated me. I was really happy. I was not happy because the conference ch...[Details]
Infineon Technologies AG announced the launch of
the new EDT2 IGBT in TO247PLUS package.
The device is specially optimized for discrete automotive traction inverters, further enriching Inf...[Details]
Airbags are inflatable bags installed in cars. They pop out when a collision occurs to protect the driver and passengers. Airbags must be used in conjunction with seat belts to achieve the desired pr...[Details]
With the rapid development of multimedia technology, network technology and the advent of the post-PC era, it has become possible to use embedded systems to realize applications such as remote vide...[Details]
On December 12, Xinjiang's first smart power Internet of Things community was put into trial operation in Xiyueju Community, Urumqi, enabling users to perceive power outage information in seconds. ...[Details]
0 Introduction
Telephones and mobile phones are one of the most commonly used communication tools in modern life. If we can make good use of the telephone network and combine it with electronic...[Details]
Dubai Municipality recently announced the introduction of artificial
intelligence robot
police to monitor traffic violations by bicycle and electric scooter riders. According to Gulf News, ...[Details]
On May 21, Honor officially released the new Honor 20 series in London, including Honor 20 and Honor 20 PRO. The new phones use a perforated full screen and rear quad-camera. Among them, Honor 20 PRO...[Details]
The emergence of the emerging field of semiconductor lighting has made engineers who specialize in power electronics, optics, and thermal management (mechanical engineering) in high demand. Current...[Details]
Guangzhou, October 18, 2024 /PRNewswire/ -- On October 17, at the new product and service launch event of the 136th China Import and Export Fair (also known as the "Canton Fair"), SGS, an internati...[Details]
DIY/Open Source Hardware
京公网安备 11010802033920号
EEWORLD
