EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

200KXF330MEFC25X20

Description
SNAP TERMINAL
CategoryPassive components   
File Size118KB,2 Pages
Manufacturerrubycon
Websitehttp://www.rubycon.co.jp/cn/
Download Datasheet Parametric View All

200KXF330MEFC25X20 Overview

SNAP TERMINAL

200KXF330MEFC25X20 Parametric

Parameter NameAttribute value
capacitance330µF
Tolerance±20%
Voltage - Rated200V
ESR (equivalent series resistance)-
Service life at different temperatures3000 hours at 105°C
Operating temperature-25°C ~ 105°C
polarizationpolarization
grade-
applicationUniversal
Ripple current @ low frequency1.15A @ 120Hz
Ripple current @ high frequency1.725A @ 10kHz
lead spacing0.394"(10.00mm)
size/dimensions0.984" diameter (25.00mm)
Height - Installation (maximum)0.866"(22.00mm)
Surface mount pad dimensions-
Installation typeThrough hole
Package/casingRadial, Can - snap-in
2. [Learning LPC1768 library functions] Keystroke experiment
The key experiment is essentially to operate the GPIO pins of Lpc1768, but unlike the LED experiment, the key experiment is to read the GPIO pin value. As can be seen from the figure below, when the k...
cxmdz NXP MCU
How to change UDP point-to-point communication to UDP broadcast communication
I used the Zhengdian Atom board to test the network port program, and the UDP point-to-point communication was successful. I want to change to broadcast mode and set the target IP address to 255.255.2...
chenbingjy stm32/stm8
Design of a USB reader based on embedded system
[size=4][color=#222222][font="] With the rapid development of USB technology and flash memory technology, the speed and capacity of mobile storage devices are changing with each passing day. However, ...
Aguilera Microcontroller MCU
Understand the development principle of WiFi endoscope HD wireless camera in wireless communication module function in one article
When it comes to wifi video transmission, do you first think of the need for a core module with video compression SOC, a huge system, a complex remote server, etc., and the excessive budget cost makes...
沉迷物联网WiFi的小哥 Innovation Lab
Analysis of common problems in TWS headset design
Some common problems that are easy to occur during the design process:The two CC1 and CC2 pins of the TYPE-C USB of the charging case cannot be short-circuited together, and each must be connected to ...
Fred_1977 Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号