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SMD4300TF30

Description
TACK FLUX IN 30CC SYRINGE NO-CLE
CategoryTools and equipment   
File Size120KB,1 Pages
ManufacturerChip Quik
Environmental Compliance
Download Datasheet Parametric View All

SMD4300TF30 Overview

TACK FLUX IN 30CC SYRINGE NO-CLE

SMD4300TF30 Parametric

Parameter NameAttribute value
typeFlux - no-clean, lead-free, sticky solder
formSyringe, 1.06 oz (30g), 30cc
shelf life24 months
Shelf life start dateManufacturing date
delivery information-
Remark-
SMD4300TF30
Datasheet revision 1.0
www.chipquik.com
Tack Flux No-Clean Water-Washable in 30cc Syringe
Product Highlights
Ideal for all rework, solder, de-solder and reflow
applications
Non-corrosive, non-conductive, no-clean, water-washable
Tack flux will not run all over PCB when applied
Has a pleasant odor
Excellent wetting
Easily cleaned with isopropyl alcohol (IPA) or water
Specifications
Flux Type:
Flux Classification:
Packaging:
Shelf Life:
Attachment of BGA spheres
Soldering flip chip components
Long stencil life
Wide process window
Clear residue
For Leaded and Lead-Free applications
RoHS II and REACH compliant
Synthetic No-Clean Water-Washable (for Leaded and Lead-Free applications)
REL0
30cc/30g Syringe
Refrigerated >24 months, Unrefrigerated >24 months
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze. Allow 4 hours for flux to reach an operating
temperature of 20-25°C (68-77°F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
1
© 1994-2017 Chip Quik® Inc.
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