N74F827DB,112 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > logic> logic> N74F827DB,112

N74F827DB,112: DescriptionIC BUF NON-INVERT 5.5V 24SSOP; Categorylogic logic; File Size96KB，11 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

Download Datasheet Parametric Compare View All

N74F827DB,112 Overview

IC BUF NON-INVERT 5.5V 24SSOP

N74F827DB,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP2
package instruction	SSOP, SSOP24,.3
Contacts	24
Manufacturer packaging code	SOT340-1
Reach Compliance Code	unknown
Other features	WITH DUAL OUTPUT ENABLE
Control type	ENABLE LOW
series	F/FAST
JESD-30 code	R-PDSO-G24
JESD-609 code	e4
length	8.2 mm
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.064 A
Humidity sensitivity level	1
Number of digits	10
Number of functions	1
Number of ports	2
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP24,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Maximum supply current (ICC)	100 mA
Prop。Delay @ Nom-Sup	18 ns
propagation delay (tpd)	14 ns
Certification status	Not Qualified
Maximum seat height	2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm
Base Number Matches	1

Preview

Download Datasheet

View All

INTEGRATED CIRCUITS

74F827

10-bit buffer/line driver, non-inverting

(3-State)

Product data

Replaces Product specification 74F827/74F828 of 1994 Dec 5

2004 Jan 21

Philips

Semiconductors

N74F827DB,112 Related Products

	N74F827DB,112	N74F827D,623	N74F827D,602	N74F827DB,118	N74F827N,602
Description	IC BUF NON-INVERT 5.5V 24SSOP	IC BUFFER NON-INVERT 5.5V 24SO	IC BUFFER NON-INVERT 5.5V 24SO	IC BUF NON-INVERT 5.5V 24SSOP	IC BUFFER NON-INVERT 5.5V 24DIP
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Maker	NXP	NXP	NXP	NXP	NXP
Parts packaging code	SSOP2	SOP	SOP	SSOP2	DIP
package instruction	SSOP, SSOP24,.3	SOP, SOP24,.4	SOP, SOP24,.4	SSOP, SSOP24,.3	DIP, DIP24,.3
Contacts	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant
Other features	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDIP-T24
length	8.2 mm	15.4 mm	15.4 mm	8.2 mm	31.7 mm
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.064 A	0.064 A	0.064 A	0.064 A	0.064 A
Number of digits	10	10	10	10	10
Number of functions	1	1	1	1	1
Number of ports	2	2	2	2	2
Number of terminals	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SOP	SOP	SSOP	DIP
Encapsulate equivalent code	SSOP24,.3	SOP24,.4	SOP24,.4	SSOP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	IN-LINE
Peak Reflow Temperature (Celsius)	260	260	260	260	245
power supply	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	100 mA	100 mA	100 mA	100 mA	100 mA
Prop。Delay @ Nom-Sup	18 ns	18 ns	18 ns	18 ns	18 ns
propagation delay (tpd)	14 ns	14 ns	14 ns	14 ns	14 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2 mm	2.65 mm	2.65 mm	2 mm	4.7 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	0.65 mm	1.27 mm	1.27 mm	0.65 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	40
width	5.3 mm	7.5 mm	7.5 mm	5.3 mm	7.62 mm
Is it Rohs certified?	conform to	conform to	conform to	conform to	-
Manufacturer packaging code	SOT340-1	SOT137-1	SOT137-1	SOT340-1	-
JESD-609 code	e4	e4	e4	e4	-
Humidity sensitivity level	1	1	1	1	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
Base Number Matches	1	1	1	1	-
Load capacitance (CL)	-	50 pF	50 pF	-	50 pF

Recommended Resources

Using CMOS to form a time-adjusted spot welding machine circuit b

Baoyi brand AJQ-1A dimming desk lamp circuit diagram

Monolithic IC Metal Detection Circuit

Multi-channel buffer amplifier circuit

555 new digital thermometer circuit

A very simple ultrasonic mosquito, insect and cockroach repellent circuit

[NUCLEO-WL55JC2 Evaluation 3] Building the NUCLEO-WL55JC2 MDK development and testing environment: [i=s]This post was last edited by nich20xx on 2020-7-3 22:50[/i] # 1 Introduction After having a systematic understanding of NUCLEO-WL55JC2, I started running the sample code of NUCLEO-WL55JC2. Since ...; nich20xx Special Edition for Assessment Centres

Feiling domestic chip series dry goods | A40i development board PWM application notes fully disclosed: This article explains the application of PWM on the domestic A40i development board. This article is mainly applicable to the Feiling OKA40i platform Linux3.10.65 operating system. Other arm platforms...; 小螃蟹呀 ARM Technology

What are the advantages of WiMi-net wireless ad hoc network communication solution?: At present, many manufacturers have their own wireless self-organizing network solutions, and each solution cannot communicate with each other. Therefore, it is very important for users to choose a pr...; chenjingjing RF/Wirelessly

Analog Circuit Experiment Instructions: E-book [;)] http://www.pcbbbs.com/showerr.asp?BoardID=4ErrCodes=54action=%B2%E9%BF%B4%CE%C4%BC%FE [code language="J#"] [/code]...; fighting Analog electronics

Large Capacity Voice Recorder SOPC Design and Matlab Simulation.pdf: Large Capacity Voice Recorder SOPC Design and Matlab Simulation.pdf...; zxopenljx EE_FPGA Learning Park

What is a wireless communication module and what is its use: The word "communication module" is often mentioned in the concept of the Internet of Things. Whether in industry news, in-depth articles or industry reports, this term is often seen, such as DDA commu...; Aguilera RF/Wirelessly

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components