EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

74HC4051N,652

Description
IC MUX/DEMUX 8X1 16DIP
CategoryAnalog mixed-signal IC    The signal circuit   
File Size228KB,31 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC4051N,652 Overview

IC MUX/DEMUX 8X1 16DIP

74HC4051N,652 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Manufacturer packaging codeSOT38-4
Reach Compliance Codecompliant
Other featuresALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY
Analog Integrated Circuits - Other TypesSINGLE-ENDED MULTIPLEXER
JESD-30 codeR-PDIP-T16
JESD-609 codee4
length19.025 mm
Number of channels8
Number of functions1
Number of terminals16
Nominal off-state isolation50 dB
On-state resistance matching specifications9 Ω
Maximum on-state resistance (Ron)180 Ω
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)260
power supply2/6,GND/-6 V
Certification statusNot Qualified
Maximum seat height4.2 mm
Maximum signal current0.025 A
Maximum supply voltage (Vsup)10 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountNO
Maximum disconnect time87 ns
Maximum connection time104 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.62 mm
Base Number Matches1

74HC4051N,652 Related Products

74HC4051N,652 74HCT4051N,112
Description IC MUX/DEMUX 8X1 16DIP IC MUX/DEMUX 8X1 16DIP
Brand Name NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to
Maker NXP NXP
Parts packaging code DIP DIP
package instruction DIP, DIP16,.3 DIP, DIP16,.3
Contacts 16 16
Manufacturer packaging code SOT38-4 SOT38-4
Reach Compliance Code compliant compliant
Other features ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY
Analog Integrated Circuits - Other Types SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 code R-PDIP-T16 R-PDIP-T16
length 19.025 mm 19.025 mm
Number of channels 8 8
Number of functions 1 1
Number of terminals 16 16
Nominal off-state isolation 50 dB 50 dB
On-state resistance matching specifications 9 Ω 9 Ω
Maximum on-state resistance (Ron) 180 Ω 180 Ω
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) 260 260
power supply 2/6,GND/-6 V 5,GND/-5 V
Certification status Not Qualified Not Qualified
Maximum seat height 4.2 mm 4.2 mm
Maximum signal current 0.025 A 0.025 A
Maximum supply voltage (Vsup) 10 V 5.5 V
Minimum supply voltage (Vsup) 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
Maximum disconnect time 87 ns 68 ns
Maximum connection time 104 ns 83 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 30 30
width 7.62 mm 7.62 mm
Base Number Matches 1 1
Little Bee SLSTK2010A Learning Sequence 5: AD Test
[i=s]This post was last edited by wudianjun2001 on 2018-7-12 12:17[/i] [align=left]These articles are part of the content to be used in the following project. The sample I made has not been returned y...
wudianjun2001 DIY/Open Source Hardware
About AD5522
Please help, is there a Chinese version of the AD5522 manual? It's too hard for me to read the English version. :Cry:...
小胖楠68 Download Centre
[Synopsys IP Resources] What is multi-die design - and why is it gaining popularity?
Several emerging applications are further driving the semiconductor industry's rapid progress to achieve significant improvements in power, performance and area (PPA).In fact, electronic designs such ...
arui1999 Integrated technical exchanges
The difference between Sendust magnetic ring in inductance and ferrite inductance
[size=4]When the inductor uses Kool Mu iron silicon aluminum magnetic powder core, the disadvantages caused by the use of gap ferrite magnetic ring can be eliminated: 1. The magnetic flux density of f...
Aguilera Analogue and Mixed Signal
imx8-cb300 core board
...
明远智睿01 ARM Technology
Embedded Development Engineer
Company Name: Dongguan Guangya Intelligent Technology Co., Ltd. Job title: Embedded Development Engineer Workplace: Unit 1706, Building 17, Jinying Building, No. 1 Jinying Road, Tianhe District, Guang...
光亚智能 Recruitment

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号