MCH15
Ceramic capacitors
Multi-layer ceramic chip capacitors
MCH15
(1005 (0402) size, chip capacitor)
!Features
1) Small size (1.0 x 0.5 x 0.5 mm) makes it perfect
for lightweight portable devices.
2) Comes packed either in tape to enable automatic
mounting or in bulk cases.
3) Precise uniformity of shape and dimensions facilitates
highly efficient automatic mounting.
4) Barrier layer and end terminations to improve
solderability.
!External
dimensions
(Units : mm)
1.0
±
0.05
0.5
±
0.05
0.5
±
0.05
0.1Min.
0.3Min.
0.5
±
0.05
!Structure
External electrode
ΙΙΙ
(coating layer)
Internal electrode
Ceramic element
External electrode
ΙΙ
(barrier layer)
External electrode
Ι
(thick membrane layer)
!Product
designation
Basic ordening unit (pcs.)
Code Product thickness Packaging specifications
Reel
K
0.5mm
Paper tape (width 8 mm, pitch 2 mm)
φ180mm
(7in.)
10,000
L
0.5mm
Paper tape (width 8 mm, pitch 2 mm)
φ330mm
(13in.)
50,000
C
0.5mm
Bulk case
−
50,000
Reel (φ180,
φ330mm)
: compatible with EIAJ ET-7200A
Bulk case: compatible with EIAJ ET-7201A
Part No.
Packaging style
M C H
Rated voltage
Code Voltage
2
25V
3
16V
5
50V
1 5
5
F N
1 0 3
Z
K
Nominal Capacitance tolerance
Capacitance-temperature characteristics
Code Code Operating temperature (°C) Temp. coefficient or percent change capacitance Code
tolerance
A
CG(C0G)
0±30ppm/°C
−55~+125
C
±
0.25pF (0.5 ~ 5pF)
CN
R
−55~+125
±15%
D
±
0.5pF (5.1 ~ 10pF)
3-digit designation
J
±
5% (11pF or more)
B
−25~+85
±10%
according to IEC
(X7R)
(−55~+125)
(±15%)
K
±
10%
FN
F
−25~+85
+30%,−80%
(Y5V)
(+22%,−82%)
(−30~+85)
Z
+
80%,
−20%
∗The
design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
0.5
±
0.05
MCH15
Ceramic capacitors
!Capacitance
range
For thermal compensation
Part number
Temperature
characteristics
Rated voltage
(V)
Tolerance
MCH15
A
(CG) (C0G)
Capacitance (pF)
50V
47
51
56
62
68
75
82
91
100
C (
±
0.25pF)
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
Product thickness (mm) 0.5
±
0.05
Part number
Temperature
characteristics
Rated voltage
(V)
Tolerance
MCH15
A
(CG) (C0G)
50V
Capacitance (pF)
0.5
0.75
1
1.1
1.2
1.3
1.5
1.6
1.8
2
2.2
2.4
2.7
3
3.3
3.6
3.9
4
4.3
4.7
5
5.1
5.6
6
6.2
6.8
7
7.5
8
8.2
9
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
J (
±
5%)
J (
±
5%)
D (
±
0.5pF)
∗The
design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
MCH15
Ceramic capacitors
High dielectric constant
Part number
Temperature
characteristics
Rated voltage (V)
Tolerance
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,900
4,700
5,600
6,800
8,200
10,000 (0.01µF)
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000 (0.1µF)
120,000
150,000
180,000
220,000
270,000
330,000
390,000
470,000
560,000
CN (R) (B) (X7R)
50V
16V
50V
MCH15
FN (F) (Y5V)
25V
Z (
+80, −20%)
16V
Capacitance (pF)
K (
±10%)
Product thickness (mm) 0.5
±
0.05
∗The
design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
MCH15
Ceramic capacitors
!Characteristics
Class 1 (For thermal compensation)
Temperature characteristics
A (CG) (C0G)
Item
Operating temperature
Nominal capacitance (C)
−55°C
~ 125°C
Must be within the specified tolerance range.
Based on paragraph 7.8 and paragraph 9
Measured at room temperature and standard humidity,
1000pF or less Measurement frequency : 1
±
0.1MHz
Measurement voltage : 1
±
0.1Vrms.
Over 1000pF Measurement frequency : 1
±
0.1kHz
Measurement voltage : 1
±
0.1Vrms.
Based on paragraph 7.6
Measurement is made after rated voltage is applied for 60
±
5s.
Based on paragraph 7.1
Apply 300% of the rated voltage for 1 to 5s then measure.
The temperature coefficients in table 12, paragraph 7.12 are
calculated at 20°C and high temperature.
Based on paragraph 8.11. 2.
Apply 5N for 10
±
1s in the
direction indicated by the arrow.
Test methods/conditions
(based on JIS C 5102)
Dissipation factor (tan
δ
)
100/(400+20C)% or less: Less than 30 pF
0.1% or less : 30 pF or larger
Insulation resistance (IR)
Withstanding voltage
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
The insulation must not be damaged.
Within 0
±
30ppm/°C
Temperature characteristics
Terminal adherence
No detachment or signs of detachment.
Pressure (5N)
Test board
Capacitor
Appearance
Resistance
to vibration
Rate of capacitance change
Dissipation factor (tan
δ)
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
At least 3/4 of the surface of the two terminals
must be covered with new solder.
Chip is mounted to a board in the manner
shown on the right, subjected to vibration
(type A in paragraph 8.2), and measured
24
±
2 hrs. later.
Based on paragraph 8.13
Soldering temperature : 235
±
5°C
Soldering time
: 2
±
0.5s
Board
Solderability
Appearance
Rate of capacitance change
Resistance
to soldering
heat
Dissipation factor (tan
δ)
Insulation resistance
Withstanding voltage
Appearance
Rate of capacitance change
Temperature
cycling
Dissipation factor (tan
δ)
Insulation resistance
Appearance
Rate of capacitance change
Humidity load
test
Dissipation factor (tan
δ)
Insulation resistance
Appearance
High-
temperature
load test
Rate of capacitance change
Dissipation factor (tan
δ)
Insulation resistance
There must be no mechanical damage.
±
2.5% or
±
0.25 pF, whichever is larger.
Must satisfy initial specified value.
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
±
2.5% or
±
0.25 pF, whichever is larger.
Must satisfy initial specified value.
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
There must be no mechanical damage.
±
7.5% or
±
0.75 pF, whichever is larger.
0.5% or less
500MΩ or 25MΩ
⋅ µF,
whichever is smaller
There must be no mechanical damage.
±
3.0% or
±
0.3 pF, whichever is larger.
0.3% or less
1,000MΩ or 50MΩ
⋅ µF,
whichever is smaller
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 24
±
2 hrs.
Based on paragraph 8.14.
Soldering temperature : 260
±
5°C
Soldering time
: 5
±
0.5s
Preheating
: 150
±
10°C for 1 to 2 min.
Based on paragraph 9.9
Test temperature : 40
±
2°C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time
: 500 to 524 hrs.
Capacitance measured after 24
±
2 hrs.
Based on paragraph 9.10
Test temperature : Max. operating temp.
Applied voltage : rated voltage
×
200%
Test time
: 1,000 to 1,048 hrs.
Capacitance measured after 24
±
2 hrs.
∗The
design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
MCH15
Ceramic capacitors
Class 2 (High dielectric constant)
Temperature characteristics
CN (R) (B) (X7R)
Item
Operating temperature
Nominal capacitance (C)
−55°C
~
+125°C
−30°C
~
+85°C
FN (F) (Y5V)
Test methods/conditions
(based on JIS C 5102)
Dissipation factor (tan
δ)
Insulation resistance (IR)
Based on paragraph 7.8
Measured at room temperature and standard humidity,
Measurement frequency: 1
±
0.1 kHz
2.5% or less
5.0% or less
(when rated voltage is 16V: 3.5% or less) (when rated voltage is 16V: 7.5% or less) Measurement voltage : 1.0
±
0.2 Vrms.
Must be within the specified tolerance range.
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
The insulation must not be damaged.
Based on paragraph 7.6
Measurement is made after rated voltage
is applied for 60
±
5s.
Based on paragraph 7.1
Apply 250% of the rated voltage for 1 to 5s then measure.
The temperature coefficients in paragraph 7.12,
table 8, condition B, are based on measurements
carried out at 20
°
C, with no voltage applied.
Based on paragraph 8. 11. 2.
Apply 5N for 10
±
1s
in the direction indicated
by the arrow.
Withstanding voltage
Temperature characteristics
Within
±
15%
+
22,
+
82%
Terminal adherence
No detachment or signs of detachment
Pressure (5N)
Test board
Capacitor
Appearance
Resistance
to vibration
Rate of capacitance change
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
Dissipation factor (tan
δ)
Solderability
Chip is mounted to a board in the
manner shown on the right, subjected
to vibration (type A in paragraph 8.2),
and measured 48
±
4 hrs. later.
Board
At least 3/4 of the surface of the two terminals must be covered with new solder.
Based on paragraph 8. 13
Soldering temperature : 235
±
5°C
: 2
±
0.5s
Soldering time
Appearance
Rate of capacitance change
Resistance
to soldering
heat
There must be no mechanical damage.
Within
±
5.0%
Within
±
20.0%
Based on paragraph 8. 14.
Soldering temperature : 260
±
5°C
Soldering time
: 5
±
0.5s
Preheating
: 150
±
10°C for
1 to 2 min.
Dissipation factor (tan
δ)
Insulation resistance
Withstanding voltage
Appearance
Must satisfy initial specified value.
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
Within
±
7.5%
Within
±
20.0%
Temperature
cycling
Rate of capacitance change
Dissipation factor (tan
δ)
Insulation resistance
Appearance
Rate of capacitance change
Must satisfy initial specified value.
10,000MΩ or 500MΩ
⋅ µF,
whichever is smaller
There must be no mechanical damage.
±
12.5% or less
5.0% or less
Within
±
30.0%
7.5% or less
(when rated voltage is 16V: 10.0%)
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 48
±
4 hrs.
Humidity load
test
Dissipation factor (tan
δ)
Insulation resistance
Appearance
Rate of capacitance change
500MΩ or 25MΩ
⋅ µF,
whichever is smaller
There must be no mechanical damage.
Within
±
10.0%
5.0% or less
Within
±
30.0%
7.5% or less
(when rated voltage is 16V: 10.0%)
Based on paragraph 9.9
Test temperature : 40
±
2°C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time
: 500 to 524 hrs.
Capacitance measured after 48
±
4 hrs.
High-
temperature
load test
Dissipation factor (tan
δ)
Insulation resistance
Based on paragraph 9.10
Test temperature : Max. operating temp.
Applied voltage : rated voltage
×
200%
Test time
: 1,000 to 1,048 hrs.
Capacitance measured after 48
±
4 hrs.
1,000MΩ or 50MΩ
⋅ µF,
whichever is smaller
∗The
design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
PCB Design
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