EEWORLDEEWORLDEEWORLD

Part Number

Search

C328C224JAR5TA

Description
CAP CER RAD 220NF 250V X7R 5%
CategoryPassive components   
File Size2MB,19 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance
Download Datasheet Parametric View All

C328C224JAR5TA Online Shopping

Suppliers Part Number Price MOQ In stock  
C328C224JAR5TA - - View Buy Now

C328C224JAR5TA Overview

CAP CER RAD 220NF 250V X7R 5%

C328C224JAR5TA Parametric

Parameter NameAttribute value
capacitance.22µF
Tolerance±5%
Voltage - Rated250V
Temperature CoefficientX7R
Operating temperature-55°C ~ 125°C
characteristic-
grade-
applicationUniversal
failure rate-
Installation typeThrough hole
Package/casingRadial
size/dimensions0.200" long x 0.125" wide (5.08mm x 3.18mm)
Height - Installation (maximum)0.300"(7.62mm)
Thickness (maximum)-
lead spacing0.200"(5.08mm)
Lead formFormed leads
Radial Leaded Multilayer Ceramic Capacitors
Goldmax, 300 Series, Conformally Coated,
X7R Dielectric, 25 – 250 VDC (Commercial Grade)
Overview
KEMET’s Goldmax conformally coated radial leaded ceramic
capacitors in X7R dielectric feature a 125°C maximum
operating temperature. The Electronics Industries Alliance
(EIA) characterizes X7R dielectric as a Class II "temperature
stable" material. Components of this classification are fixed,
ceramic dielectric capacitors suited for bypass and decoupling
applications or for frequency discriminating circuits where Q
and stability of capacitance characteristics are not critical. X7R
exhibits a predictable change in capacitance with respect to time
and voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is limited
to ±15% from −55°C to +125°C.
These devices meets the flame test requirements outlined in
UL Standard 94V–0.
Benefits
• Radial leaded form factor
• Conformally coated
• 0.100", 0.200", 0.250" and 0.400" lead spacing
• −55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• X7R temperature stable dielectric
Click image above for interactive 3D content
Ordering Information
C
Ceramic
Open PDF in Adobe Reader for full functionality
320
Style/Size
315
316
317
318
320
321
322
323
324
325
326
327
328
330
331
333
335
336
340
346
350
356
C
Specification/
Series
C=
Standard
106
Capacitance
Code (pF)
K
3
R
5
Design
5=
Multilayer
T
Lead
Finish
2
T = 100%
Matte Sn
H = SnPb
(60/40)
A
7301
Capacitance Rated Voltage
Dielectric
Tolerance
1
(VDC)
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R=
X7R
Failure
Packaging
Rate
(C-Spec)
A=
N/A
See
"Packaging
C-Spec
Ordering
Options
Table"
below
First two digits J = ±5%
represent
K = ±10%
significant
M = ±20%
figures. Third
digit specifies
number of zeros.
1
2
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Lead materials:
Standard: 100% matte tin (Sn) with nickel (Ni) underplate and steel core ( “T” designation).
Alternative 1: 60% tin (Sn)/40% lead (Pb) finish with copper-clad steel core ( “H” designation).
Alternative 2: 60% tin (Sn)/40% lead (Pb) finish with 100% copper core (available with “H” designation code with C-Spec). Contact KEMET for
C-Spec details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1050_GOLDMAX_X7R • 1/10/2017
1
National Technology: N32G45x_Library.1.3.0_for_gcc and documentation for using the GCC development environment under Windows
This document takes N32L43x as an example to introduce the installation and use of the GCC For ARM compiler tool chain in Windows environment. Users can refer to this document to build a development e...
nmg Domestic Chip Exchange
MOSFET turn-on schedule question
As shown in the figure, Pspice simulates the mosfet turn-on process. The waveform obtained by simulation is shown in the figure (blue is Vds, red is Vgs, and green is Id), which is different from the ...
ujs Analog electronics
Introduction to DA14585 Bluetooth chip and its application range
SmartBond DA14585 is the smallest, lowest power and most integrated Bluetooth 5.0 SoC. As IoT devices continue to evolve, smarter, lower power and more comprehensive products continue to emerge, so Sm...
Jacktang RF/Wirelessly
[2022 Digi-Key Innovation Design Competition] Material Unboxing - STM32F7508 Development Board + BLDC Brushless Motor Driver Board
First of all, I would like to thank the staff of Electronic Engineering World and Digi-Key Electronics for the honor and fortune to participate in this competition. Through the competition, I can lear...
许慧清 DigiKey Technology Zone
The gift redemption speed is really fast
I have a business trip on the 12th and I am a little confused whether to exchange it before or after the trip. I am afraid that the express delivery will be lost if it is piled up too much. I saw the ...
cardin6 Talking
DSP 28335Control Suit lighting experiment
[i=s]This post was last edited by Aguilera on 2020-8-8 18:18[/i]First of all, Example_2833xLEDBlink is the code DSP2833x eZdsp LED Blink Getting Started Program provided by the official TI company .I ...
Aguilera DSP and ARM Processors

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号