FIFO, 1KX9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | QFJ |
package instruction | PLASTIC, LCC-32 |
Contacts | 32 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum access time | 50 ns |
Other features | RETRANSMIT |
period time | 65 ns |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
memory density | 9216 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX9 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 0.08 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Base Number Matches | 1 |