IC GATE AND 3CH 3-INP 14DIP
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconductor |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Manufacturer packaging code | SOT27-1 |
| Reach Compliance Code | compliant |
| series | F/FAST |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e4 |
| length | 19.025 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.02 A |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | TUBE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Maximum supply current (ICC) | 9.7 mA |
| Prop。Delay @ Nom-Sup | 6.6 ns |
| propagation delay (tpd) | 6.6 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 4.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | NICKEL PALLADIUM GOLD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| Base Number Matches | 1 |
| N74F11N,602 | N74F10D,623 | N74F10D,602 | N74F11D,623 | N74F11D,602 | N74F10N,602 | |
|---|---|---|---|---|---|---|
| Description | IC GATE AND 3CH 3-INP 14DIP | IC GATE NAND 3CH 3-INP 14SO | IC GATE NAND 3CH 3-INP 14SO | IC GATE AND 3CH 3-INP 14SO | IC GATE AND 3CH 3-INP 14SO | IC GATE NAND 3CH 3-INP 14DIP |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | DIP | SOIC | SOIC | SOIC | SOIC | DIP |
| package instruction | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Manufacturer packaging code | SOT27-1 | SOT108-1 | SOT108-1 | SOT108-1 | SOT108-1 | SOT27-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 19.025 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 19.025 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | AND GATE | NAND GATE | NAND GATE | AND GATE | AND GATE | NAND GATE |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of entries | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP | SOP | SOP | DIP |
| Encapsulate equivalent code | DIP14,.3 | SOP14,.25 | SOP14,.25 | SOP14,.25 | SOP14,.25 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 9.7 mA | 7.7 mA | 7.7 mA | 9.7 mA | 9.7 mA | 7.7 mA |
| Prop。Delay @ Nom-Sup | 6.6 ns | 6 ns | 6 ns | 6.6 ns | 6.6 ns | 6 ns |
| propagation delay (tpd) | 6.6 ns | 6 ns | 6 ns | 6.6 ns | 6.6 ns | 6 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| Maximum seat height | 4.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
| width | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| Maker | NXP | NXP | NXP | - | NXP | - |
| method of packing | TUBE | TAPE AND REEL | - | TAPE AND REEL | TUBE | TUBE |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 |
| Humidity sensitivity level | - | 1 | 1 | 1 | 1 | - |
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