N74F10N,602 datasheet, PDF - EEWORLD Datasheet

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N74F10N,602: DescriptionIC GATE NAND 3CH 3-INP 14DIP; Categorylogic logic; File Size73KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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N74F10N,602 Overview

IC GATE NAND 3CH 3-INP 14DIP

N74F10N,602 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14
Manufacturer packaging code	SOT27-1
Reach Compliance Code	compliant
series	F/FAST
JESD-30 code	R-PDIP-T14
JESD-609 code	e4
length	19.025 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.02 A
Number of functions	3
Number of entries	3
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Maximum supply current (ICC)	7.7 mA
Prop。Delay @ Nom-Sup	6 ns
propagation delay (tpd)	6 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	4.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm
Base Number Matches	1

N74F10N,602 Related Products

	N74F10N,602	N74F10D,623	N74F10D,602	N74F11D,623	N74F11D,602	N74F11N,602
Description	IC GATE NAND 3CH 3-INP 14DIP	IC GATE NAND 3CH 3-INP 14SO	IC GATE NAND 3CH 3-INP 14SO	IC GATE AND 3CH 3-INP 14SO	IC GATE AND 3CH 3-INP 14SO	IC GATE AND 3CH 3-INP 14DIP
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIP	SOIC	SOIC	SOIC	SOIC	DIP
package instruction	DIP, DIP14,.3	SOP, SOP14,.25	SOP, SOP14,.25	SOP, SOP14,.25	SOP, SOP14,.25	DIP, DIP14,.3
Contacts	14	14	14	14	14	14
Manufacturer packaging code	SOT27-1	SOT108-1	SOT108-1	SOT108-1	SOT108-1	SOT27-1
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
series	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST	F/FAST
JESD-30 code	R-PDIP-T14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
JESD-609 code	e4	e4	e4	e4	e4	e4
length	19.025 mm	8.65 mm	8.65 mm	8.65 mm	8.65 mm	19.025 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	AND GATE	AND GATE	AND GATE
MaximumI(ol)	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Number of functions	3	3	3	3	3	3
Number of entries	3	3	3	3	3	3
Number of terminals	14	14	14	14	14	14
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	SOP	DIP
Encapsulate equivalent code	DIP14,.3	SOP14,.25	SOP14,.25	SOP14,.25	SOP14,.25	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	7.7 mA	7.7 mA	7.7 mA	9.7 mA	9.7 mA	9.7 mA
Prop。Delay @ Nom-Sup	6 ns	6 ns	6 ns	6.6 ns	6.6 ns	6.6 ns
propagation delay (tpd)	6 ns	6 ns	6 ns	6.6 ns	6.6 ns	6.6 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO
Maximum seat height	4.2 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	4.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	7.62 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	7.62 mm
method of packing	TUBE	TAPE AND REEL	-	TAPE AND REEL	TUBE	TUBE
Base Number Matches	1	1	1	1	-	1
Maker	-	NXP	NXP	-	NXP	NXP
Humidity sensitivity level	-	1	1	1	1	-

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