JFET N-CH 25V 250MW SOT23
Parameter Name | Attribute value |
Brand Name | NXP Semiconductor |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | TO-236 |
package instruction | PLASTIC PACKAGE-3 |
Contacts | 3 |
Manufacturer packaging code | SOT23 |
Reach Compliance Code | compliant |
Other features | LOW NOISE |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 25 V |
FET technology | JUNCTION |
Maximum feedback capacitance (Crss) | 2.5 pF |
highest frequency band | VERY HIGH FREQUENCY BAND |
JEDEC-95 code | TO-236AB |
JESD-30 code | R-PDSO-G3 |
JESD-609 code | e3 |
Humidity sensitivity level | 1 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | DEPLETION MODE |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 0.25 W |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | Tin (Sn) |
Terminal form | GULL WING |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
transistor applications | AMPLIFIER |
Transistor component materials | SILICON |
PMBFJ310,215 | PMBFJ308,215 | PMBFJ309,215 | PMBFJ309T/R | PMBFJ310T/R | PMBFJ309-T | PMBFJ308-T | PMBFJ310-T | PMBFJ308T/R | |
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Description | JFET N-CH 25V 250MW SOT23 | JFET N-CH 25V 250MW SOT23 | JFET N-CH 25V 250MW SOT23 | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal | TRANSISTOR VHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET RF Small Signal |
Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
Parts packaging code | TO-236 | TO-236 | TO-236 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 |
package instruction | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 |
Contacts | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | unknown | unknown | unknown | unknow |
Other features | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE | LOW NOISE |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Minimum drain-source breakdown voltage | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V |
FET technology | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION |
Maximum feedback capacitance (Crss) | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF | 2.5 pF |
highest frequency band | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND | VERY HIGH FREQUENCY BAND |
JEDEC-95 code | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB |
JESD-30 code | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Operating mode | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
transistor applications | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER | AMPLIFIER |
Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | - | - | - | conform to |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | - | - | - | e3 |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | - | - | - | 260 |
Maximum power dissipation(Abs) | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | - | - | - | 0.25 W |
Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | TIN | Matte Tin (Sn) | - | - | - | TIN |
Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | - | - | - | 40 |