CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Operating Specifications
Unless otherwise noted, V
DD
= +2.7V to +5.5V, T
A
= -40°C to +85°C, Typical values are @ T
A
= +25°C and
V
DD
= 3.3V.
MIN
(Note 12)
2.7
1.8
MAX
(Note 12)
5.5
5.5
SYMBOL
V
DD
V
BAT
PARAMETER
Main Power Supply
Backup Power Supply
CONDITIONS
TYP
UNIT
V
V
Electrical Specifications
SYMBOL
I
DD1
PARAMETER
Supply Current with I
2
C Active
V
DD
= 2.7V
V
DD
= 5.5V
I
DD2
Supply Current for Non-Volatile
Programming
Supply Current for Main Timekeeping
(Low Power Mode)
Battery Supply Current
V
DD
= 2.7V
V
DD
= 5.5V
V
DD
= V
SDA
= V
SCL
= 2.7V
V
DD
= V
SDA
= V
SCL
= 5.5V
V
BAT
= 1.8V, V
DD
= V
SDA
= V
SCL
= 0V
V
BAT
= 3.0V, V
DD
= V
SDA
= V
SCL
= 0V
I
BATLKG
V
TRIP
V
TRIPHYS
V
BATHYS
V
DD SR-
IRQ/F
OUT
V
OL
Output Low Voltage
V
DD
= 5V
I
OL
= 3mA
V
DD
= 1.8V
I
OL
= 1mA
I
LO
Output Leakage Current
V
DD
= 5.5V
V
OUT
= 5.5V
100
0.4
0.4
400
V
V
nA
Battery Input Leakage
V
BAT
Mode Threshold
V
TRIP
Hysteresis
V
BAT
Hysteresis
V
DD
Negative Slew Rate
V
DD
= 5.5V, V
BAT
= 1.8V
1.8
2.2
30
50
10
800
850
CONDITIONS
MIN
(Note 12)
TYP
MAX
(Note 12)
500
800
2.5
3.5
10
20
1000
1200
100
2.6
UNIT
µA
µA
mA
mA
µA
µA
nA
nA
nA
V
mV
mV
V/ms
7
7
7
8
NOTES
3, 4, 5
3, 4, 5
3, 4, 5
3, 4, 5
5
5
3, 6, 7
3, 6, 7
I
DD3
I
BAT
FN6749 Rev 1.00
December 15, 2011
Page 3 of 24
ISL12024IRTC
EEPROM Specifications
PARAMETER
EEPROM Endurance
EEPROM Retention
Temperature
75°C
TEST CONDITIONS
MIN
2,000,000
50
TYP
MAX
UNITS
Cycles
Years
Serial Interface (I
2
C) Specifications
DC Electrical Specifications
SYMBOL
V
IL
V
IH
Hysteresis
V
OL
I
LI
I
LO
PARAMETER
SDA, and SCL Input Buffer LOW
Voltage
SDA, and SCL Input Buffer HIGH
Voltage
SDA and SCL Input Buffer Hysteresis
SDA Output Buffer LOW Voltage
Input Leakage Current on SCL
I/O Leakage Current on SDA
I
OL
= 4mA
V
IN
= 5.5V
V
IN
= 5.5V
TEST CONDITIONS
MIN
(Note 12)
-0.3
0.7 x V
DD
0.05 x V
DD
0
100
100
0.4
TYP
MAX
(Note 12)
0.3 x V
DD
V
DD
+ 0.3
UNITS
V
V
V
V
nA
nA
9, 11
NOTES
AC Electrical Specifications
SYMBOL
f
SCL
t
IN
t
AA
t
BUF
PARAMETER
SCL Frequency
Pulse width Suppression Time at
SDA and SCL Inputs
SCL Falling Edge to SDA Output
Data Valid
Time the Bus Must be Free Before
the Start of a New Transmission
Clock LOW Time
Clock HIGH Time
START Condition Set-up Time
START Condition Hold Time
Input Data Set-up Time
Any pulse narrower than the max spec is
suppressed.
SCL falling edge crossing 30% of V
DD
, until
SDA exits the 30% to 70% of V
DD
window.
SDA crossing 70% of V
DD
during a STOP
condition, to SDA crossing 70% of V
DD
during
the following START condition.
Measured at the 30% of V
DD
crossing.
Measured at the 70% of V
DD
crossing.
SCL rising edge to SDA falling edge. Both
crossing 70% of V
DD
.
From SDA falling edge crossing 30% of V
DD
to
SCL falling edge crossing 70% of V
DD
.
From SDA exiting the 30% to 70% of V
DD
window, to SCL rising edge crossing 30% of
V
DD
.
From SCL rising edge crossing 70% of V
DD
to
SDA entering the 30% to 70% of V
DD
window.
From SCL rising edge crossing 70% of V
DD
, to
SDA rising edge crossing 30% of V
DD
.
From SDA rising edge to SCL falling edge. Both
crossing 70% of V
DD
.
From SCL falling edge crossing 30% of V
DD
,
until SDA enters the 30% to 70% of V
DD
window.
1300
TEST CONDITIONS
MIN
(Note 12)
MAX
TYP (Note 12) UNITS NOTES
400
50
900
kHz
ns
ns
ns
t
LOW
t
HIGH
t
SU:STA
t
HD:STA
t
SU:DAT
1300
600
600
600
100
ns
ns
ns
ns
ns
t
HD:DAT
t
SU:STO
t
HD:STO
t
DH
Input Data Hold Time
STOP Condition Set-up Time
STOP Condition Hold Time for
Read, or Volatile Only Write
Output Data Hold Time
0
600
600
0
ns
ns
ns
ns
FN6749 Rev 1.00
December 15, 2011
Page 4 of 24
ISL12024IRTC
AC Electrical Specifications
SYMBOL
Cpin
t
WC
t
R
t
F
Cb
R
PU
PARAMETER
SDA and SCL Pin Capacitance
Non-Volatile Write Cycle Time
SDA and SCL Rise Time
SDA and SCL Fall Time
From 30% to 70% of V
DD
From 70% to 30% of V
DD
20+0.1xCb
20+0.1xCb
10
1
12
(Continued)
TEST CONDITIONS
MIN
(Note 12)
MAX
TYP (Note 12) UNITS NOTES
10
20
300
300
400
pF
ms
ns
ns
pF
k
9, 11
10
9, 11
9, 11
9, 11
9, 11
Capacitive Loading of SDA or SCL Total on-chip and off-chip.
SDA and SCL Bus Pull-up Resistor Maximum is determined by t
R
and t
F
.
Off-chip
For Cb = 400pF, max is about 2k~2.5k.
For Cb = 40pF, max is about 15k~20k
NOTES:
3. IRQ/F
OUT
Inactive.
4. V
IL
= V
DD
x 0.1, V
IH
= V
DD
x 0.9, f
SCL
= 400kHz
5. V
DD
> V
BAT
+V
BATHYS
6. Bit BSW = 0 (Standard Mode), ATR = 00h, V
BAT
1.8V
7. Specified at +25°C.
8. In order to ensure proper timekeeping, the V
DD SR-
specification must be followed.
9. Limits established by characterization and are not production tested.
10. t
WC
is the minimum cycle time to be allowed for any non-volatile Write by the user (it is the time from valid STOP condition at the end of Write
sequence of a serial interface Write operation) to the end of the self-timed internal non-volatile write cycle.
11. These are I
2
C specific parameters and are not directly tested, however they are used during device testing to validate device specification.
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization