DT17A Double-Sided Nickel/Copper
Fabric Tape
NI/CU DOUBLE-SIDED CONDUCTIVE FABRIC TAPE
Laird Technologies’ DT17A double-sided conductive fabric tape is constructed of nickel/copper
metallized fabric with conductive pressure sensitive adhesives (PSA) on both sides. This reliable
tape provides XYZ-axis electrical conductivity, EMI shielding performance, a well-balanced design in
adhesion, flame retardant, and thermal conductivity.
DT17A is RoHS compliant and halogen free. It’s good for EMI/RFI shielding to electronic devices.
FEATURES
• RoHS compliant
• Halogen-free per IEC-61249-2-21 standard
• Shielding effectiveness of >70 dB across
a wide spectrum of frequencies
MARKETS
•
•
•
•
•
•
Cabinet applications
LCD and Plasma TV
Medical equipment
Servers
Printers
Laptop computers
COMPOSITION OF PRODUCT
Die Cut
Roll Form
Release paper
Conductive PSA
Cu/Ni metallized
conductive fabric
Conductive PSA
Release paper
Conductive PSA
Cu/Ni metallized
conductive fabric
Conductive PSA
Release paper
USA: +1.866.928.8181
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
DT17A Double-Sided Nickel/Copper
Fabric Tape
Test Method
-
PSTC 101*
PSTC 107
#
PSTC 107
#
-
UL510-FR method
^
-
ASTM D5470
IEEE-299 (modified)
dB
dB
dB
M
76
89
87
W: Dimension by Customer Spec
L: Standard Length of 20 M
One Year
^:Internal Test
+: Typical Value
Item
Thickness
Peel Adhesion
Shear Adhesion
at R.T.
at 80°C
Tensile Strength
Operation Temperature
Flammability
Z-axial Resistance
Thermal Resistance at 50°C/10 psi
Far-field Shielding
+
30 MHz to 300 MHz
300 MHz to 3 GHz
3 GHz to 18 GHz
Package Dimensions
(Max. Width: 1000 mm)
Shelf Life (Under 23°C/65% R.H.)
Unit
mm
Kgf / 25 mm
Hrs
Hrs
Kgf / 25 mm
°C
-
Ω
°C-in
2
/W
Value
0.17 ± 0.02
>1.4
>168
>5
>15
0-80
Pass
<0.08
0.9 typical
*:Test Method
C,
dwell time 30 min. #:Contact area 25 mm by 25 mm
APPLICATION TECHNIQUES
1. Bond strength is dependent upon the amount of adhesive-to-surface contact developed.
Firm application pressure develops better adhesive contact & thus improves bond strength.
2. To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified.
A typical surface cleaning solvent is isopropyl alcohol. Use proper safety precautions for
handling solvents.
3. Ideal tape application temperature range is 21°C to 38°C. Initial tape application to surfaces
at temperatures below 10°C is not recommended because the adhesive becomes too firm to
adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
EMI-DS-FOF-DT17A 0414
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of
Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for
any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and
Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies
Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein
provides a license under any Laird Technologies or any third party intellectual property rights.
Test/Measurement
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