IS63WV1288DBLL-10TLI-TR datasheet, PDF

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IS63WV1288DBLL-10TLI-TR: DescriptionStandard SRAM, 128KX8, 10ns, CMOS, PDSO32; Categorystorage; File Size475KB，20 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS63WV1288DBLL-10TLI-TR Overview

Standard SRAM, 128KX8, 10ns, CMOS, PDSO32

IS63WV1288DBLL-10TLI-TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Reach Compliance Code	compliant
Factory Lead Time	8 weeks
Is Samacsys	N
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP
Encapsulate equivalent code	TSOP32,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum standby current	0.000055 A
Minimum standby current	2 V
Maximum slew rate	0.055 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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IS63WV1288DALL/DALS

IS63WV1288DBLL/DBLS

IS64WV1288DBLL/DBLS

128K x 8 HIGH-SPEED CMOS STATIC RAM

FEATURES

HIGH SPEED: (IS63/64WV1288DALL/DBLL)

• High-speed access time: 8, 10, 12, 20 ns

• Low Active Power: 135 mW (typical)

• Low Standby Power: 12 µW (typical)

CMOS standby

LOW POWER: (IS63/64WV1288DALS/DBLS)

• High-speed access time: 25, 35 ns

• Low Active Power: 55 mW (typical)

• Low Standby Power: 12 µW (typical)

CMOS standby

• Single power supply

— V

1.65V to 2.2V (IS63WV1288DAxx)

— V

2.4V to 3.6V (IS63/64WV1288DBxx)

• Multiple center power and ground pins for

greater noise immunity

• Easy memory expansion with

and

options

•

power-down

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Lead-free available

DECEMBER 2011

DESCRIPTION

The

ISSI

IS63/64WV1288Dxxx is a very high-speed,

low power, 131,072-word by 8-bit CMOS static RAM.

The IS63/64WV1288DBLL is fabricated using

ISSI

high-performance CMOS technology. This highly reliable

process coupled with innovative circuit design

techniques, yields higher performance and low power

consumption devices.

When

is HIGH (deselected), the device assumes a

standby mode at which the power dissipation can be re-

duced down to 25 µW (typical) with CMOS input levels.

The IS63/64WV1288DBLL operates from a single V

power supply. The IS63/64WV1288Dxxx is available in

32-pin TSOP (Type II), 32-pin sTSOP (Type I), 48-Ball

miniBGA (6mm x 8mm), 32-pin SOJ (400-mil) and 32-

pin SOJ (300-mil) packages.

FUNCTIONAL BLOCK DIAGRAM

A0-A16

DECODER

128K X 8

MEMORY ARRAY

VDD

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CONTROL

CIRCUIT

assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device

specification before relying on any published information and before placing orders for products.

Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-

pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon

Solution, Inc. receives written assurance to its satisfaction, that:

a.) the risk of injury or damage has been minimized;

b.) the user assume all such risks; and

c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances

Integrated Silicon Solution, Inc. — www.issi.com —

1-800-379-4774

Rev. B

12/15/2011

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant	compliant
Maximum access time	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns
JESD-30 code	R-PDSO-G32	R-PDSO-J32	R-PDSO-J32	R-PDSO-G32	R-PDSO-G32	R-PDSO-J32	R-PDSO-J32
memory density	1048576 bit	1048576 bi	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP	SOJ	SOJ	TSOP2	TSSOP	SOJ	SOJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	J BEND	J BEND	GULL WING	GULL WING	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Factory Lead Time	8 weeks	8 weeks	8 weeks	8 weeks	-	-	8 weeks
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Encapsulate equivalent code	TSOP32,.46	SOJ32,.34	SOJ32,.34	TSOP32,.46	TSSOP32,.56,20	SOJ32,.44	-
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum standby current	0.000055 A	0.000055 A	0.000055 A	0.000055 A	0.000055 A	0.000055 A	-
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	-
Maximum slew rate	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	0.055 mA	-
Base Number Matches	1	1	1	1	1	-	-
package instruction	-	SOJ, SOJ32,.34	-	TSOP2, TSOP32,.46	-	SOJ, SOJ32,.44	SOJ,
length	-	20.955 mm	-	20.95 mm	-	20.95 mm	20.95 mm
Number of functions	-	1	-	1	-	1	1
Peak Reflow Temperature (Celsius)	-	260	-	260	-	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	-	3.405 mm	-	1.2 mm	-	3.76 mm	3.76 mm
Maximum supply voltage (Vsup)	-	3.6 V	-	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.4 V	-	2.4 V	-	2.4 V	2.4 V
Maximum time at peak reflow temperature	-	40	-	40	-	NOT SPECIFIED	NOT SPECIFIED
width	-	7.62 mm	-	10.16 mm	-	10.16 mm	10.16 mm

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