GS8672Q18BE-300I datasheet, PDF

GS8672Q18BE-300I: DescriptionSRAM 1.8 or 1.5V 4M x 18 72M; Categorystorage storage; File Size334KB，28 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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SRAM 1.8 or 1.5V 4M x 18 72M

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Factory Lead Time	12 weeks
Maximum access time	0.45 ns
Maximum clock frequency (fCLK)	300 MHz
I/O type	SEPARATE
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	75497472 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
power supply	1.5/1.8,1.8 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Minimum standby current	1.7 V
Maximum slew rate	1.12 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	15 mm

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