SRAM 2.5 or 3.3V 1M x 18 18M
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | GSI Technology |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 119 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Factory Lead Time | 10 weeks |
| Maximum access time | 5.5 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY |
| JESD-30 code | R-PBGA-B119 |
| length | 22 mm |
| memory density | 18874368 bit |
| Memory IC Type | ZBT SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of terminals | 119 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1MX18 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.99 mm |
| Maximum supply voltage (Vsup) | 2.7 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
