8-Bit Microcontroller
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | CERQUAD-68 |
| Reach Compliance Code | unknow |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| CPU series | 6800 |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | S-CQCC-J68 |
| JESD-609 code | e0 |
| length | 23.975 mm |
| Number of I/O lines | 54 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WQCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, WINDOW |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 16384 |
| ROM programmability | OTPROM |
| Maximum seat height | 5.08 mm |
| speed | 3 MHz |
| surface mount | YES |
| technology | HCMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 23.975 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC68HC711J6FS | MC68HC711J6 | MC68HC711J6FU | MC68HC711J6FN | |
|---|---|---|---|---|
| Description | 8-Bit Microcontroller | 8-Bit Microcontroller | 8-Bit Microcontroller | 8-Bit Microcontroller |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | CERQUAD-68 | - | QFP-64 | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknow | - | unknow | unknow |
| Has ADC | NO | - | NO | NO |
| Address bus width | 16 | - | 16 | 16 |
| bit size | 8 | - | 8 | 8 |
| CPU series | 6800 | - | 6800 | 6800 |
| DAC channel | NO | - | NO | NO |
| DMA channel | NO | - | NO | NO |
| External data bus width | 8 | - | 8 | 8 |
| JESD-30 code | S-CQCC-J68 | - | S-PQFP-G64 | S-PQCC-J68 |
| JESD-609 code | e0 | - | e0 | e0 |
| length | 23.975 mm | - | 14 mm | 24.2062 mm |
| Number of I/O lines | 54 | - | 54 | 54 |
| Number of terminals | 68 | - | 64 | 68 |
| Maximum operating temperature | 85 °C | - | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C |
| PWM channel | NO | - | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | WQCCJ | - | QFP | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | - | QFP64(UNSPEC) | LDCC68,1.0SQ |
| Package shape | SQUARE | - | SQUARE | SQUARE |
| Package form | CHIP CARRIER, WINDOW | - | FLATPACK | CHIP CARRIER |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| RAM (bytes) | 512 | - | 512 | 512 |
| rom(word) | 16384 | - | 16384 | 16384 |
| ROM programmability | OTPROM | - | OTPROM | OTPROM |
| Maximum seat height | 5.08 mm | - | 2.45 mm | 4.57 mm |
| speed | 3 MHz | - | 3 MHz | 3 MHz |
| surface mount | YES | - | YES | YES |
| technology | HCMOS | - | HCMOS | HCMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | - | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | - | 0.8 mm | 1.27 mm |
| Terminal location | QUAD | - | QUAD | QUAD |
| width | 23.975 mm | - | 14 mm | 24.2062 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER |
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