AEC-Q200 Compliant Water Repellent Chip Multilayer Ceramic Capacitors for Infotainment
GXT1555C1H270JA02_ (0402, C0G:EIA, 27pF, DC50V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Water Repellent Chip Multilayer Ceramic Capacitors used for Car Multimedia, Car Interior, Car Comfort application and General
Electronic equipment. Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).
This product is applied for Only Reflow Soldering.
2.MURATA Part NO. System
(Ex.)
GXT
15
(1)L/W
Dimensions
5
(2)T
Dimensions
5C
(3)Temperature
Characteristics
1H
(4)Rated
Voltage
270
(5)Nominal
Capacitance
J
(6)Capacitance
Tolerance
A02
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
(2) T
0.5±0.05
e
0.15 to 0.35
(Unit:mm)
g
0.3 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
0±30 ppm/°C
25 to 125 °C
(25 °C)
DC 50 V
27 pF
±5 %
-55 to 125 °C
5.Package
mark
D
W
J
(8) Packaging
f180mm
Reel
PAPER W8P2
f180mm
Reel
PAPER W8P1
f330mm
Reel
PAPER W8P2
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
Product specifications in this catalog are as of Nov.13,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GXT1555C1H270JA02-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
Specifications.
No
AEC-Q200 Test Item
Pre-and Post-Stress
Electrical Test
2 High Temperature
Exposure (Storage)
Appearance
Capacitance
Change
Q or D.F.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-2.5% or +/-0.25pF
(Whichever is larger)
30pFmin. : Q≧350
10pF and over, 30pF and below:Q≧275+5C/2
10pFmax.: Q
≧200+10C
C: Nominal Capacitance(pF)
Insulation
Resistance
25℃
3 Temperature Cycling
Appearance
Capacitance
Change
Q or D.F.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-2.5% or +/-0.25pF
(Whichever is larger)
30pFmin. : Q≧1000
30pFmax.: Q
≧400+20C
C: Nominal Capacitance(pF)
Insulation
Resistance
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
More than 1000MΩ or 50Ω・F
(Whichever is smaller)
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
4 Destructive
Phisical Analysis
5 Biased Humidity
Appearance
Capacitance
Change
Q or D.F.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within +/-3.0% or +/-0.30pF
(Whichever is larger)
30pF and over: Q≧200
30pF and below: Q≧100+10C/3
C: Nominal Capacitance(pF)
Insulation
Resistance
25℃
More than 1000MΩ or 50Ω・F
(Whichever is smaller)
More than 100MΩ or 5Ω・F
(Whichever is smaller)
・Measurement
after test for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
0.2 max.
Within +/-12.5%
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8kΩ resister)
at 85+/-3℃ and 80%RH to 85%RH humidity for 1000+/-12 hours.
The charge/discharge current is less than 50mA.
No defects or abnormalities
Per EIA-469
0.2 max.
Within +/-10.0%
Solder the capacitor on the test substrate(glass epoxy board).
Perform cycles test according to the four heat treatments
in the following table.
Set for 24+/-2 hours at room temperature, then measure.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
More than 500MΩ or 25Ω・F
(Whichever is smaller)
0.2 max.
Within +/-12.5%
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000+/-12 hours at maximum operating
temperature +/-3℃.
Set for 24+/-2 hours at room temperature, then measure.
Temperature
Compensating Type
AEC-Q200 Test Method
High Dielectric Type
-
1
Step
1
2
3
4
Time(min)
15+/-3
1
15+/-3
1
Cycles
1000
-40℃+0/-3
Room
105℃+3/-0
Room
5
-55℃+0/-3
Room
125℃+3/-0
Room
JEMCGS-05957
2
■AEC-Q200
Murata Standard Specification and Test Methods
Specifications.
No
AEC-Q200 Test Item
Temperature
Compensating Type
AEC-Q200 Test Method
High Dielectric Type
Solder the capacitor on the test substrate(glass epoxy board).
Apply 100% of the rated voltage for 1000+/-12 hours at maximum operating
temperature +/-3℃.
The charge/discharge current is less than 50mA.
6 Operational Life
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Q or D.F.
Within +/-3.0% or +/-0.30pF
(Whichever is larger)
30pFmin. : Q≧350
10pF and over, 30pF and below:
Q≧275+5C/2
10pFmax.: Q
≧200+10C
C: Nominal Capacitance(pF)
More than 1000MΩ or 50Ω・F
(Whichever is smaller)
Within +/-12.5%
・
Initial measurement for high dielectric constant type
0.2 max.
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
・Measurement
after test for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
More than 100MΩ or 5Ω
・F
(Whichever is smaller)
for 24+/-2 hours at room temperature. Perform the initial measurement.
Insulation
Resistance
25℃
7 External Visual
No defects or abnormalities
Visual inspection
8 Phisical Dimension
Within the specified dimensions
Using Measuring instrument of dimension.
9 Resistance to
Solvents
Appearance
No marking defects
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance
Within the specified initial value.
Within the specified initial value.
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Q or D.F.
Solvent 3 : 42 parts (by volume) of water
1
part (by volume) of propylene glycol monomethylether
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
1 part (by volume) of monoethanolomine
Insulation
Resistance
25℃
10 Mechanical
Shock
Capacitance
Appearance
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
Within the specified initial value.
Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
Q or D.F.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
Insulation
Resistance
25℃
11 Vibration
Appearance
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance
Within the specified initial value.
Within the specified initial value.
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10Hz and 2000Hz.
Q or D.F.
The frequency range, from 10Hz to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
Insulation
Resistance
25℃
12 Resistance to
Soldering Heat
Appearance
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
This motion should be applied for 12 cycles in each 3 mutually
perpendicular directions (total of 36 times).
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260+/-5℃ for 10+/-1 seconds.
Set for 24+/-2 hours at room temperature, then measure.
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
Capacitance
Within the specified initial value.
Within the specified initial value.
Q or D.F.
for 24+/-2 hours at room temperature. Perform the initial measurement.
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
Insulation
Resistance
25℃
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
JEMCGS-05957
3
■AEC-Q200
Murata Standard Specification and Test Methods
Specifications.
No
AEC-Q200 Test Item
Temperature
Compensating Type
specifications in the following table.
Appearance
Capacitance
Change
High Dielectric Type
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20 seconds).
Set for 24+/-2 hours at room temperature, then measure.
13 Thermal Shock
The measured and observed characteristics shall satisfy the
No marking defects
Within +/-2.5% or +/-0.25pF
(Whichever is larger)
Within the specified initial value.
Within +/-10.0%
Step
Temp.
(℃)
Time
(min)
1
-40+0/-3
15+/-3
2
105+3/-0
15+/-3
Q or D.F.
Insulation
Resistance
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
25℃
14 ESD
Appearance
Capacitance
Q or D.F.
Insulation
Resistance
25℃
No marking defects
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω
・F
(Whichever is smaller)
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
Per AEC-Q200-002
Voltage setting level : 2kV
15 Solderability
95% of the terminations is to be soldered evenly and continuously.
(a) Preheat at 155℃ for 4 hours. After preheating,
immerse the capacitor in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(b) should be placed into steam aging for 8 hours+/-15 minutes.
After preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(c) should be placed into steam aging for 8 hours+/-15 minutes.
After
preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5 seconds at 260+/-5℃.
16 Electrical
Chatacteri-
zation
Appearance
Capacitance
No defects or abnormalities
Shown in Rated value.
30pFmin. : Q≧1000
30pFmax.: Q
≧400+20C
C: Nominal Capacitance(pF)
0.125 max.
Visual inspection.
The capacitance/Q/D.F. should be measured at 25℃ at the
frequency and voltage shown in the table.
Q or D.F.
(1)Temperature Compensating Type
Char.
C≦1000pF
Item
Frequency
Voltage
1.0+/-0.1MHz
0.5Vrms to 5.0Vrms
1.0+/-0.1kHz
1.0+/-0.2Vrms
C＞1000pF
(2)High Dielectric Constant Type
Char
Item.
Frequency
Voltage
C
≦10F
6.3V max.
1.0+/-0.1kHz
0.5+/-0.1Vrms
10V min.
1.0+/-0.1kHz
1.0+/-0.2Vrms
120+/-24Hz
0.5+/-0.1Vrms
10F < C
Insulation
Resistance
25℃
Insulation
Resistance
125℃
Dielectric
Strength
More than 100000MΩ or 1000Ω・F
(Whichever is smaller)
More than 10000MΩ or 100Ω・F
(Whichever is smaller)
No failure
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
More than 100MΩ or 5Ω
・F
(Whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and 125℃ within 1 minute
of charging.
The charge/discharge current is less than 50mA.
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 second to 5 seconds.
The charge/discharge current is less than 50mA.
JEMCGS-05957
4
■AEC-Q200
Murata Standard Specification and Test Methods
Specifications.
No
AEC-Q200 Test Item
Appearance
Capacitance
or
Capacitance
Change
Q or D.F.
Within the specified initial value.
Temperature
Compensating Type
No marking defects
Within +/-5.0% or +/-0.5pF
(Whichever is larger)
Within the specified initial value.
High Dielectric Type
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60 seconds.
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
½ﾝﾃﾞﾝ½
17 Board Flex
Insulation
Resistance
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
Series
GXT15
GXT18
GXT21
45
GXT31
GXT32
a
0.5
0.6
0.8
2.0
2.0
45
b
1.5
2.2
3.0
支持台
4.4
4.4
c
0.6
0.9
1.3
1.7
2.6
(in mm)
Land
b
20
50min.
Pressurizing
speed:1.0mm/s
Pressurize
f4.5
R4
a
100
Capacitance meter
45
Fig.2
45
40
c
c
Fig.1
t : 1.6mm
(GXT15:0.8mm)
Flexure：2
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：1
(Chip thickness≦0.85mm rank
High Dielectric type)
Flexure：2
(Temperature Compensating type)
18 Terminal
Strength
Appearance
Capacitance
Q or D.F.
Insulation
Resistance
25℃
No marking defects
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω
・F
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
(Whichever is smaller)
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60 seconds.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*2N(GXT15)
Series
GXT15
GXT18
GXT21
GXT31
GXT32
a
0.4
1.0
1.2
2.2
2.2
c
b
1.5
3.0
4.0
5.0
5.0
c
0.5
1.2
1.65
2.0
2.9
（in
mm）
b
a
ﾗﾝﾄﾞ
b
f4.5
t : 1.6mm
(GXT15:0.8mm)
Solder resist
Baked electrode
or copper foil
c
a
19 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Apply a force.
Fig.3
Place the capacitor in the beam load fixture as Fig 4.
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