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GS881E32CD-150I

Description
SRAM 2.5 or 3.3V 256K x 32 8M
Categorystorage    storage   
File Size334KB,37 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
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GS881E32CD-150I Overview

SRAM 2.5 or 3.3V 256K x 32 8M

GS881E32CD-150I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA,
Contacts165
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.B
Factory Lead Time8 weeks
Maximum access time7.5 ns
Other featuresPIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density8388608 bit
Memory IC TypeCACHE SRAM
memory width32
Number of functions1
Number of terminals165
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX32
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
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