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MR4A16BUYS45R

Description
NVRAM 16Mb 3.3V 45ns 1Mx16 Parallel MRAM
Categorystorage   
File Size820KB,16 Pages
ManufacturerEverspin Technologies
Environmental Compliance
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MR4A16BUYS45R Overview

NVRAM 16Mb 3.3V 45ns 1Mx16 Parallel MRAM

MR4A16BUYS45R Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerEverspin Technologies
Product CategoryNVRAM
RoHSDetails
Package / CaseTSOP-54
Interface TypeParallel
Memory Size16 Mbit
Organization1 M x 16
Data Bus Width16 bit
Access Time45 ns
Supply Voltage - Max3.6 V
Supply Voltage - Min3 V
Operating Supply Current180 mA
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 125 C
PackagingReel
Mounting StyleSMD/SMT
Moisture SensitiveYes
Pd - Power Dissipation0.6 W
Factory Pack Quantity1000

MR4A16BUYS45R Related Products

MR4A16BUYS45R MR4A16BYS35R MR4A16BCMA35 MR4A16BCMA35R MR4A16BYS35 MR4A16BUYS45
Description NVRAM 16Mb 3.3V 45ns 1Mx16 Parallel MRAM NVRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM NVRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM NVRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM NVRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM NVRAM 16Mb 3.3V 45ns 1Mx16 Parallel MRAM
Is it Rohs certified? - conform to conform to conform to conform to -
Parts packaging code - TSSOP2 BGA BGA TSSOP2 -
package instruction - TSOP2, TSOP54,.46,32 LFBGA, BGA48,6X8,30 LFBGA, BGA48,6X8,30 TSOP2, TSOP54,.46,32 -
Contacts - 54 48 48 54 -
Reach Compliance Code - compliant compliant compliant compliant -
ECCN code - EAR99 EAR99 EAR99 EAR99 -
Maximum access time - 35 ns 35 ns 35 ns 35 ns -
JESD-30 code - R-PDSO-G54 S-PBGA-B48 S-PBGA-B48 R-PDSO-G54 -
length - 22.22 mm 10 mm 10 mm 22.22 mm -
memory density - 16777216 bit 16777216 bit 16777216 bit 16777216 bit -
Memory IC Type - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT -
memory width - 16 16 16 16 -
Mixed memory types - N/A N/A N/A N/A -
Number of functions - 1 1 1 1 -
Number of terminals - 54 48 48 54 -
word count - 1048576 words 1048576 words 1048576 words 1048576 words -
character code - 1000000 1000000 1000000 1000000 -
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature - 70 °C 85 °C 85 °C 70 °C -
organize - 1MX16 1MX16 1MX16 1MX16 -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code - TSOP2 LFBGA LFBGA TSOP2 -
Encapsulate equivalent code - TSOP54,.46,32 BGA48,6X8,30 BGA48,6X8,30 TSOP54,.46,32 -
Package shape - RECTANGULAR SQUARE SQUARE RECTANGULAR -
Package form - SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE -
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
power supply - 3.3 V 3.3 V 3.3 V 3.3 V -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height - 1.2 mm 1.35 mm 1.35 mm 1.2 mm -
Maximum standby current - 0.014 A 0.014 A 0.014 A 0.014 A -
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) - 3 V 3 V 3 V 3 V -
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V -
surface mount - YES YES YES YES -
technology - CMOS CMOS CMOS CMOS -
Temperature level - COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL -
Terminal form - GULL WING BALL BALL GULL WING -
Terminal pitch - 0.8 mm 0.75 mm 0.75 mm 0.8 mm -
Terminal location - DUAL BOTTOM BOTTOM DUAL -
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width - 10.16 mm 10 mm 10 mm 10.16 mm -
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