|
HCF40107M013TR |
HCF40107BM1 |
Description |
Logic Gates 2-Input NAND Buffer |
Logic Gates 2-Input NAND Buffer |
Is it Rohs certified? |
conform to |
conform to |
Maker |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
SOIC |
SOIC |
package instruction |
SOP-8 |
SOP, SOP8,.25 |
Contacts |
8 |
8 |
Reach Compliance Code |
compliant |
compliant |
series |
4000/14000/40000 |
4000/14000/40000 |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e4 |
e4 |
length |
4.9 mm |
4.9 mm |
Load capacitance (CL) |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
Humidity sensitivity level |
1 |
1 |
Number of functions |
2 |
2 |
Number of entries |
2 |
2 |
Number of terminals |
8 |
8 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
method of packing |
TAPE AND REEL |
TUBE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
5/15 V |
5/15 V |
Prop。Delay @ Nom-Sup |
200 ns |
200 ns |
propagation delay (tpd) |
200 ns |
200 ns |
Certification status |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
Maximum seat height |
1.75 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
20 V |
20 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
width |
3.9 mm |
3.9 mm |