IDT72403L25PG datasheet, PDF - EEWORLD Datasheet

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IDT72403L25PG: DescriptionFIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16; Categorystorage; File Size350KB，8 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT72403L25PG Overview

FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16

IDT72403L25PG Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-16
Contacts	16
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	34 ns
Other features	FALL THRU 40NS
period time	40 ns
JESD-30 code	R-PDIP-T16
JESD-609 code	e3
length	19.1135 mm
memory density	256 bit
memory width	4
Number of functions	1
Number of terminals	16
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64X4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	4.191 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm
Base Number Matches	1

IDT72403L25PG Related Products

	IDT72403L25PG	72403L25PG	72403L15PG	IDT72403L15PG	72403L15SOG	IDT72403L15SOG	72403L25SOG	IDT72403L25SOG
Description	FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16	FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16	FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16	FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16	FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16	FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16	FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16	FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	DIP	DIP	DIP	DIP	SOIC	SOIC	SOIC	SOIC
package instruction	0.300 INCH, PLASTIC, DIP-16	0.300 INCH, PLASTIC, DIP-16	0.300 INCH, PLASTIC, DIP-16	0.300 INCH, PLASTIC, DIP-16	SOIC-16	SOIC-16	SOIC-16	SOIC-16
Contacts	16	16	16	16	16	16	16	16
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	34 ns	34 ns	40 ns	40 ns	40 ns	40 ns	34 ns	34 ns
Other features	FALL THRU 40NS	FALL THRU 40NS	FALL THRU 65NS	FALL THRU 65NS	FALL THRU 65NS	FALL THRU 65NS	FALL THRU 40NS	FALL THRU 40NS
period time	40 ns	40 ns	66.67 ns	66.67 ns	66.67 ns	66.67 ns	40 ns	40 ns
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3
length	19.1135 mm	19.1135 mm	19.1135 mm	19.1135 mm	10.3 mm	10.3 mm	10.3 mm	10.3 mm
memory density	256 bit	256 bit	256 bit	256 bit	256 bit	256 bit	256 bit	256 bit
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16	16
word count	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words
character code	64	64	64	64	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64X4	64X4	64X4	64X4	64X4	64X4	64X4	64X4
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	SOP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.191 mm	4.191 mm	4.191 mm	4.191 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	Matte Tin (Sn) - annealed	MATTE TIN	Matte Tin (Sn) - annealed	MATTE TIN
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm
Humidity sensitivity level	-	1	1	-	1	1	1	1

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