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IDT72403L25SOG

Description
FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16
Categorystorage    storage   
File Size350KB,8 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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IDT72403L25SOG Overview

FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16

IDT72403L25SOG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeSOIC
package instructionSOIC-16
Contacts16
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time34 ns
Other featuresFALL THRU 40NS
period time40 ns
JESD-30 codeR-PDSO-G16
JESD-609 codee3
length10.3 mm
memory density256 bit
memory width4
Humidity sensitivity level1
Number of functions1
Number of terminals16
word count64 words
character code64
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64X4
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.5 mm

IDT72403L25SOG Related Products

IDT72403L25SOG 72403L25PG IDT72403L25PG 72403L15PG IDT72403L15PG 72403L15SOG IDT72403L15SOG 72403L25SOG
Description FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16 FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16 FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16 FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code SOIC DIP DIP DIP DIP SOIC SOIC SOIC
package instruction SOIC-16 0.300 INCH, PLASTIC, DIP-16 0.300 INCH, PLASTIC, DIP-16 0.300 INCH, PLASTIC, DIP-16 0.300 INCH, PLASTIC, DIP-16 SOIC-16 SOIC-16 SOIC-16
Contacts 16 16 16 16 16 16 16 16
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 34 ns 34 ns 34 ns 40 ns 40 ns 40 ns 40 ns 34 ns
Other features FALL THRU 40NS FALL THRU 40NS FALL THRU 40NS FALL THRU 65NS FALL THRU 65NS FALL THRU 65NS FALL THRU 65NS FALL THRU 40NS
period time 40 ns 40 ns 40 ns 66.67 ns 66.67 ns 66.67 ns 66.67 ns 40 ns
JESD-30 code R-PDSO-G16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
length 10.3 mm 19.1135 mm 19.1135 mm 19.1135 mm 19.1135 mm 10.3 mm 10.3 mm 10.3 mm
memory density 256 bit 256 bit 256 bit 256 bit 256 bit 256 bit 256 bit 256 bit
memory width 4 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16 16 16
word count 64 words 64 words 64 words 64 words 64 words 64 words 64 words 64 words
character code 64 64 64 64 64 64 64 64
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64X4 64X4 64X4 64X4 64X4 64X4 64X4 64X4
Exportable YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP DIP DIP DIP SOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 4.191 mm 4.191 mm 4.191 mm 4.191 mm 2.65 mm 2.65 mm 2.65 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30
width 7.5 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.5 mm 7.5 mm 7.5 mm
Humidity sensitivity level 1 1 - 1 - 1 1 1
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