FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | SOIC |
package instruction | SOIC-16 |
Contacts | 16 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 34 ns |
Other features | FALL THRU 40NS |
period time | 40 ns |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e3 |
length | 10.3 mm |
memory density | 256 bit |
memory width | 4 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 16 |
word count | 64 words |
character code | 64 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64X4 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 2.65 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 7.5 mm |
IDT72403L25SOG | 72403L25PG | IDT72403L25PG | 72403L15PG | IDT72403L15PG | 72403L15SOG | IDT72403L15SOG | 72403L25SOG | |
---|---|---|---|---|---|---|---|---|
Description | FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16 | FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | FIFO, 64X4, 34ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16 | FIFO, 64X4, 40ns, Asynchronous, CMOS, PDSO16, SOIC-16 | FIFO, 64X4, 34ns, Asynchronous, CMOS, PDSO16, SOIC-16 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Parts packaging code | SOIC | DIP | DIP | DIP | DIP | SOIC | SOIC | SOIC |
package instruction | SOIC-16 | 0.300 INCH, PLASTIC, DIP-16 | 0.300 INCH, PLASTIC, DIP-16 | 0.300 INCH, PLASTIC, DIP-16 | 0.300 INCH, PLASTIC, DIP-16 | SOIC-16 | SOIC-16 | SOIC-16 |
Contacts | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 34 ns | 34 ns | 34 ns | 40 ns | 40 ns | 40 ns | 40 ns | 34 ns |
Other features | FALL THRU 40NS | FALL THRU 40NS | FALL THRU 40NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 40NS |
period time | 40 ns | 40 ns | 40 ns | 66.67 ns | 66.67 ns | 66.67 ns | 66.67 ns | 40 ns |
JESD-30 code | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
length | 10.3 mm | 19.1135 mm | 19.1135 mm | 19.1135 mm | 19.1135 mm | 10.3 mm | 10.3 mm | 10.3 mm |
memory density | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit |
memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
word count | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
character code | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 64X4 | 64X4 | 64X4 | 64X4 | 64X4 | 64X4 | 64X4 | 64X4 |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | DIP | DIP | DIP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.65 mm | 4.191 mm | 4.191 mm | 4.191 mm | 4.191 mm | 2.65 mm | 2.65 mm | 2.65 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | NO | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) - annealed | MATTE TIN | Matte Tin (Sn) - annealed |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm |
Humidity sensitivity level | 1 | 1 | - | 1 | - | 1 | 1 | 1 |