FIFO 512X9 CMOS PARALLEL FIFO
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | CDIP |
package instruction | DIP, DIP28,.6 |
Contacts | 28 |
Manufacturer packaging code | CD28 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 80 ns |
Other features | RETRANSMIT |
Maximum clock frequency (fCLK) | 10 MHz |
period time | 100 ns |
JESD-30 code | R-GDIP-T28 |
JESD-609 code | e0 |
length | 37.211 mm |
memory density | 4608 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512X9 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Certification status | Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.0009 A |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 20 |
width | 15.24 mm |
Base Number Matches | 1 |