MC10H600, MC100H600
9−Bit TTL to ECL Translator
Description
The MC10H/100H600 is a 9−bit, dual supply TTL to ECL
translator. Devices in the ON Semiconductor 9−bit translator series
utilize the PLCC−28 for optimal power pinning, signal flow−through
and electrical performance.
The H600 features both ECL and TTL logic enable controls for
maximum flexibility.
The 10H version is compatible with MECL 10H ECL logic levels.
The 100H version is compatible with 100K levels.
Features
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•
9−Bit Ideal for Byte−Parity Applications
•
Flow−Through Configuration
•
Extra TTL and ECL Power/Ground Pins to Minimize
•
•
•
•
•
•
Switching Noise
ECL and TTL Enable Inputs
Dual Supply
3.5 ns Max D to Q
PNP TTL Inputs for Low Loading
Choice of ECL Compatibility:
MECL 10H (10Hxxx) or 100K (100Hxxx)
Pb−Free Packages are Available*
PLCC−28
FN SUFFIX
CASE 776
MARKING DIAGRAM*
1
MCxxxH600G
AWLYYWW
xxx
A
WL
YY
WW
G
= 10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
November, 2006
−
Rev. 9
1
Publication Order Number:
MC10H600/D
MC10H600, MC100H600
D5
25
D4 V
CCT
D3
24
23
22
D2
21
D1 D0
20
19
18
17
16
15
Table 1. PIN NAMES
Q0
Q1
V
CCE
V
CCO
Q2
V
CCO
Q3
PIN
GND
V
CCE
V
CCO
V
CCT
V
EE
D0
−D8
Q0
−Q8
ENECL
ENTTL
FUNCTION
TTL Ground (0 V)
ECL V
CC
(0 V)
ECL V
CC
(0 V)
−
Outputs
TTL Supply (+ 5.0 V)
ECL Supply (− 5.2 /
−4.5
V)
Data Inputs (TTL)
Data Outputs (ECL)
Enable Control (ECL)
Enable Control (TTL)
D6
D7
D8
GND
ENTTL
NC
ENECL
26
27
28
2
3
4
5
6
7
8
9
10
11
14
13
12
Q8 Q7 V
CCO
Q6 V
EE
Q5
Q4
Figure 1. Pinout: PLCC−28
(Top View)
ENECL
ENTTL
D0
D1
D2
D3
TTL
D4
D5
D6
D7
D8
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
ECL
Table 2. TRUTH TABLE
ENECL
H
H
X
X
L
ENTTL
X
X
H
H
L
D
H
L
H
L
X
Q
H
L
H
L
L
Figure 2. Logic Symbol
Table 3. DC CHARACTERISTICS:
V
CCT
= 5.0 V
±
10%; V
EE
=
−
5.2 V
±
5% (10H version); V
EE
=
−
4.2 V to
−
5.5 V (100H)
0°C
Symbol
Power Supply Current
I
EE
I
CCH
I
CCL
ECL
TTL
10H
100H
−125
−122
48
50
−125
−123
48
50
−125
−132
48
50
mA
mA
Parameter
Min
Max
Min
25°C
Max
Min
75°C
Max
Unit
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H600, MC100H600
Table 4. 10H ECL DC CHARACTERISTICS:
V
CCT
= 5.0 V
±
10%; V
EE
=
−
5.2 V
±
5%
0°C
Symbol
I
INH
I
IL
V
IH
V
IL
V
OH
V
OL
Parameter
Input HIGH Current
Input LOW Current
Input HIGH Voltage
Input LOW Voltage
Output HIGH Voltage
Output LOW Voltage
50
W
to
−
2.0 V
Condition
Min
0.5
−1170
−1950
−1020
−1950
Max
225
−840
−1480
−840
−1630
Min
0.5
−1130
−1950
−980
−1950
25°C
Max
175
−810
−1480
−810
−1630
Min
0.5
−1070
−1950
−920
−1950
75°C
Max
175
−735
−1450
−735
−1600
Unit
mA
mA
mV
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 5. 100H ECL DC CHARACTERISTICS:
V
CCT
= 5.0 V
±
10%; V
EE
=
−
4.2 V to
−
5.5 V
0°C
Symbol
I
INH
I
IL
V
IH
V
IL
V
OH
V
OL
Parameter
Input HIGH Current
Input LOW Current
Input HIGH Voltage
Input LOW Voltage
Output HIGH Voltage
Output LOW Voltage
50
W
to
−
2.0 V
Condition
Min
0.5
−1165
−1810
−1025
−1810
Max
255
−880
−1475
−880
−1620
Min
0.5
−1165
−1810
−1025
−1810
25°C
Max
175
−880
−1475
−880
−1620
Min
0.5
−1165
−1810
−1025
−1810
75°C
Max
175
−880
−1475
−880
−1620
Unit
mA
mA
mV
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. TTL DC CHARACTERISTICS:
V
CCT
= 5.0 V
±
10%; V
EE
=
−
5.2 V
±
5% (10H); V
EE
=
−
4.2 V to
−
5.5 V (100H)
0°C
Symbol
V
IH
V
IL
I
IH
I
IL
V
IK
Parameter
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
Input Clamp Voltage
V
IN
= 2.7 V
V
IN
= 7.0 V
V
IN
= 0.5 V
I
IN
=
−18
mA
Condition
Min
2.0
Max
0.8
20
100
−0.6
−1.2
Min
2.0
25°C
Max
0.8
20
100
−0.6
−1.2
Min
2.0
75°C
Max
0.8
20
100
−0.6
−1.2
Unit
V
V
mA
mA
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10H600, MC100H600
Table 7. AC CHARACTERISTICS:
V
CCT
= 5.0 V
±
10%; V
EE
=
−
5.2 V
±
5% (10H); V
EE
=
−4.2
V to
−
5.5 V (100H)
0°C
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay to Output
D
ENECL /
ENTTL
Output Rise/Fall Time
20%
−80%
Condition
50
W
to
−
2.0 V
Min
1.4
1.8
0.5
Max
3.0
3.7
1.5
Min
1.5
1.9
0.5
25°C
Max
3.2
3.9
1.5
Min
1.7
2.0
0.5
75°C
Max
3.5
4.1
1.5
Unit
ns
ns
ns
t
R
t
F
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H600FN
MC10H600FNG
MC10H600FNR2
MC10H600FNR2G
MC100H600FN
MC100H600FNG
MC100H600FNR2
MC100H600FNR2G
Package
PLCC−28
PLCC−28
(Pb−Free)
PLCC−28
PLCC−28
(Pb−Free)
PLCC−28
PLCC−28
(Pb−Free)
PLCC−28
PLCC−28
(Pb−Free)
Shipping
†
37 Units / Rail
37 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
37 Units / Rail
37 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
ECL Clock Distribution Techniques
−
Designing with PECL (ECL at +5.0 V)
−
ECLinPSt I/O SPiCE Modeling Kit
−
Metastability and the ECLinPS Family
−
Interfacing Between LVDS and ECL
−
The ECL Translator Guide
−
Odd Number Counters Design
−
Marking and Date Codes
−
Termination of ECL Logic Devices
−
Interfacing with ECLinPS
−
AC Characteristics of ECL Devices
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4
MC10H600, MC100H600
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
Y BRK
D
Z
−L−
−M−
B
0.007 (0.180)
U
M
T L−M
M
S
N
S
S
−N−
0.007 (0.180)
T L−M
N
S
W
28
1
D
V
X
VIEW D−D
G1
0.010 (0.250)
S
T L−M
S
N
S
A
Z
R
E
G
G1
0.010 (0.250)
S
0.007 (0.180)
0.007 (0.180)
M
M
T L−M
T L−M
S
S
N
N
S
S
H
0.007 (0.180)
M
T L−M
S
N
S
C
K1
0.004 (0.100)
−T−
SEATING
PLANE
J
K
F
VIEW S
0.007 (0.180)
M
VIEW S
T L−M
S
T L−M
S
N
S
N
S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2
_
10
_
0.410
0.430
0.040
−−−
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
10.42
10.92
1.02
−−−
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