74LVCH16244AEV/G,5 datasheet, PDF

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74LVCH16244AEV/G,5: DescriptionBuffers & Line Drivers 3.3V BUF/LN DRVR; Categorylogic logic; File Size252KB，19 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74LVCH16244AEV/G,5 Overview

Buffers & Line Drivers 3.3V BUF/LN DRVR

74LVCH16244AEV/G,5 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Maker	NXP
Parts packaging code	BGA
package instruction	VFBGA, BGA56,6X10,25
Contacts	56
Manufacturer packaging code	SOT702-1
Reach Compliance Code	compliant
Control type	ENABLE LOW
series	LVC/LCX/Z
JESD-30 code	R-PBGA-B56
length	7 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.024 A
Humidity sensitivity level	2
Number of digits	4
Number of functions	4
Number of ports	2
Number of terminals	56
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA56,6X10,25
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TRAY
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Sup	5.5 ns
propagation delay (tpd)	6 ns
Certification status	Not Qualified
Maximum seat height	0.97 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.2 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	4.5 mm
Base Number Matches	1

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74LVC16244A; 74LVCH16244A

16-bit buffer/line driver; 5 V input/output tolerant; 3-state

Rev. 14 — 15 June 2017

Product data sheet

General description

The 74LVC16244A; 74LVCH16244A are 16-bit non-inverting buffer/line drivers with

3-state bus compatible outputs. The device can be used as four 4-bit buffers, two 8-bit

buffers or one 16-bit buffer. It features four output enable inputs, (1OE to 4OE) each

controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a

high-impedance OFF-state.

Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be

applied to the outputs. These features allow the use of these devices in mixed 3.3 V and

5 V applications.

The 74LVCH16244A bus hold on data inputs eliminates the need for external pull-up

resistors to hold unused inputs.

Features and benefits

•

5 V tolerant inputs/outputs for interfacing with 5 V logic

Wide supply voltage range from 1.2 V to 3.6 V

CMOS low power consumption

Multibyte flow-through standard pin-out architecture

Low inductance multiple power and ground pins for minimum noise and ground bounce

Direct interface with TTL levels

High-impedance when V

= 0 V

All data inputs have bus hold. (74LVCH16244A only)

Complies with JEDEC standard:

–

JESD8-7A (1.65 V to 1.95 V)

–

JESD8-5A (2.3 V to 2.7 V)

–

JESD8-C/JESD36 (2.7 V to 3.6 V)

•

ESD protection:

–

HBM JESD22-A114F exceeds 2000 V

–

MM JESD22-A115-B exceeds 200 V

–

CDM JESD22-C101E exceeds 1000 V

•

Specified from -40 °C to +85 °C and -40 °C to +125 °C

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Description	Buffers & Line Drivers 3.3V BUF/LN DRVR	Buffers & Line Drivers 16-bit buffer/line driver	Buffers & Line Drivers 3.3V 16-BIT DRVR 3-S	Buffers & Line Drivers 3.3V BUF/LN DRVR	Buffers & Line Drivers 16bit buffer/line driver 5V inpt/outpt	Buffers & Line Drivers 3.3V 16-BIT DRVR 3-S	Buffers & Line Drivers 16-CH Non-Inverting Buffer/Line Driver	Buffers & Line Drivers 74LVC16244AEV/VFBGA56/STANDARD	Buffers & Line Drivers 74LVCH16244AEV/VFBGA56/STANDAR
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	BGA	BGA	TSSOP	BGA	TSSOP	SSOP	TSSOP	BGA	BGA
package instruction	VFBGA, BGA56,6X10,25	VFBGA,	TSSOP, TSSOP48,.3,20	VFBGA, BGA56,6X10,25	6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48	SSOP, SSOP48,.4	TSSOP, TSSOP48,.3,20	VFBGA, BGA56,6X10,25	VFBGA, BGA56,6X10,25
Contacts	56	56	48	56	48	48	48	56	56
Manufacturer packaging code	SOT702-1	SOT702-1	SOT362-1	SOT702-1	SOT362-1	SOT370-1	SOT362-1	SOT702-1	SOT702-1
Reach Compliance Code	compliant	not_compliant	compliant	compliant	compliant	compliant	compliant	unknown	unknown
Base Number Matches	1	1	1	1	1	1	1	1	1
Control type	ENABLE LOW	-	ENABLE LOW	ENABLE LOW	-	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PBGA-B56	R-PBGA-B56	R-PDSO-G48	R-PBGA-B56	-	R-PDSO-G48	R-PDSO-G48	R-PBGA-B56	R-PBGA-B56
length	7 mm	7 mm	12.5 mm	7 mm	-	15.875 mm	12.5 mm	7 mm	7 mm
Load capacitance (CL)	50 pF	-	50 pF	50 pF	-	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.024 A	-	0.024 A	0.024 A	-	0.024 A	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	2	2	1	2	-	1	1	-	-
Number of digits	4	4	4	4	-	4	4	4	4
Number of functions	4	4	4	4	-	4	4	4	4
Number of ports	2	2	2	2	-	2	2	2	2
Number of terminals	56	56	48	56	-	48	48	56	56
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	-	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	TSSOP	VFBGA	-	SSOP	TSSOP	VFBGA	VFBGA
Encapsulate equivalent code	BGA56,6X10,25	-	TSSOP48,.3,20	BGA56,6X10,25	-	SSOP48,.4	TSSOP48,.3,20	BGA56,6X10,25	BGA56,6X10,25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TRAY	-	TUBE	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TRAY	TRAY
Peak Reflow Temperature (Celsius)	260	240	260	260	-	260	260	-	-
power supply	3.3 V	-	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	5.5 ns	-	5.5 ns	5.5 ns	-	5.5 ns	5.5 ns	5.5 ns	5.5 ns
propagation delay (tpd)	6 ns	6 ns	6 ns	6 ns	-	6 ns	6 ns	6 ns	6 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.97 mm	0.97 mm	1.2 mm	1 mm	-	2.8 mm	1.2 mm	1 mm	1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	-	1.2 V	1.2 V	1.2 V	1.2 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	-	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	BALL	GULL WING	BALL	-	GULL WING	GULL WING	BALL	BALL
Terminal pitch	0.65 mm	0.65 mm	0.5 mm	0.65 mm	-	0.635 mm	0.5 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM	DUAL	BOTTOM	-	DUAL	DUAL	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	20	30	30	-	30	40	-	-
width	4.5 mm	4.5 mm	6.1 mm	4.5 mm	-	7.5 mm	6.1 mm	4.5 mm	4.5 mm
Is it Rohs certified?	-	incompatible	conform to	conform to	conform to	conform to	conform to	incompatible	incompatible
JESD-609 code	-	e0	e4	-	-	e4	e4	e0	e0
Terminal surface	-	Tin/Lead (Sn63Pb37)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	-	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	TIN LEAD	TIN LEAD

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