DIFFERENTIAL CONNECTOR
FCN-260(D) Series microGiGaCN
™
RoHS Compliant
n
FEATURES
• I/O Connector designed for high speed differential
signal applications.
• Matched Impedance (100 ohms ±10%)
• Low insertion loss
• Low cross talk
• Adopted by InfiniBand as 10G Ethernet, SAS, &
sATA for 4x/12x Interface
n
SPECIFICATIONS
I t em
Operating temperature
range
Current rating
Max. allowable voltage
Contact resistance
(20m VDC 10mA)
Insulation resistance
Dielectric withstanding
voltage
Durability
Insertion force
Withdrawl force
Sp ec i f i c at i o n s
-55˚C to +85˚C
AC 0.5A (signal)
AC 1A (ground)
AC 30
80 m ohms max. (signal)
45 m ohms max.(ground)
1000M ohms minimu m
AC 500V for 1 minute
250 cycle s
55.5 N max. (8 pair)
73 N max. (24 pair)
2.5 N min. (8 pair)
8 N min. (24 pair)
n
MATERIALS
It em
Insulator
Conductor
Plating
Mat er i al s
LCP Resin (UL94V-0 )
Copper Allo y
Contact: Gold Plating (PAGOS)
Terminal: Gold coat over Pd-Ni
plating
Cover: Zinc
Product Specification are subject to
change, please check our website
(http://us.fujitsu.com/connectors)
for
the latest specifications.
Specifications subject to change
http://us.fujitsu.com/connectors
1
microGiGaCN™ FCN- 260 (D) Series
The MicroGigaCN offers a cost-effective
I/O solution for high-speed applications in data and
telecommunications convergence (voice, data, video
and storage). It offers four or twelve link widths,
offering a scalable performance range of 500Mbps
to 6Gbps per link to meet the needs of entry-level
and high-end enterprise systems. Forward crosstalk
is less than 4% at 100 pico second pulse-rise
time (four-pair switching).
Fujitsu Components designed the MicroGiGaCN
to specifically address the requirements for a high
speed differential signal I/O connector.
Electrical Performance in out testing:
The MicroGiGaCN offers a unique solution to
LVDS, InfiniBand, 10G Ethernet, 3G/6G SAS
& SATA, and other high speed I/O applications.
InfiniBand, IEEE802.3ak, SAS, & SATA have
selected Fujitsu’s connector for the 4x and 12x I/O
connector interface.
The performance requirements of the connector
system were tested with cable to simulate the actual
requirements of an OEM System manufacturer. Our
test data includes the parasitic effects of the PCB,
along with measurements of a completed I/O cable
assembly.
•
•
•
•
•
Matched Impedance:
Low Cross Talk:
Low Insertion Loss:
Skew pair to pair:
100±10 ohms @ 100 ps Trise
NEXT 4.0% @ 100pc Trise (20 to 80%)
2.3dB @ 2.5Gbps (1.25GHz, 1 meter Cable Assembly)
14.4ps (2 connectors and 2 meter of cable)
21.2ps (2 connectors and 2 meter of cable)
Skew within Differential Pair:
Connection
Specifications subject to change
http://us.fujitsu.com/connectors
2
microGiGaCN™ FCN- 260 (D) Series
Basic Concept for Differential Transfer
Basic Concept for Differential
Transfer
Sectional View
(Connection area)
1.5 mm
0.75 mm
Virtual ground
plane
+
Patent pending
+
+
Outer shield
1.27 mm
-
Differential pair contact
-
-
Ground/Power contact
Product Specification are subject to change, please check our website
(http://us.fujitsu.com/connectors) for the latest specifications.
Fujitsu Components has designed the
mechanical features of the connector to provide space
saving footprint that will allow for 3 4x I/O connectors
to mount onto a PCI form, or 2 12x. As RFI/EMI are
critical elements in high performance cable assemblies,
Fujitsu Components provides the surface mount
sockets with an EMI Ground Spring on the face of
the connector, to insure that the metal surface of the
connector makes sufficient contact with the metal face
of the card bracket.
The latching mechanism of the backshell
offers a lanyard system for ease of un-mating the
I/O plug connector/cable assembly from the SMT I/O
socket. The die cast backshell offers excellent RFI/
EMI characteristics. The backshell uses a ferrule and
unique ground spring system to provide 360 degree
contact of the cable shield to the backshell, which,
combined with the solid interconnect of the socket to
faceplate, offers low AC coupling termination.
The current version of the I/O plug comes
with an attached paddlecard for wire termination.
Fujitsu offers the paddlecard in either an equalized
or un-equalized version (see factory for details of the
equalized version). Standard product offering will be
un-equalized. As there are multiple applications for
the paddlecard, with industry and customer specific
wire termination, Fujitsu Components offers options
to customers of providing the I/O plug connector with
custom paddlecards (consult factory).
Specifications subject to change
http://us.fujitsu.com/connectors
3
microGiGaCN™ FCN- 260 (D) Series
CABLE I/O JACK SCREW LOCK TYPE - WITH ALIGNMENT PIN / WITH CRUSH PIN
n
DIMENSIONS
Insula tor
Signal con tact
( J1)
J2
J3
9.6
6.75
7.39
+0.3
0
Y
S(mx2)
G(n)
Front su rface of shield c over
to top of he xagon sc rew
( J1)
J2
J3
9.6
6.75
Insula tor
Signal con tact
5.8 Max
Gas ket
Solder po st
X
Y
12
S(2)
G(1)
7.39
+0.3
0
10.075
G(n)
1.2
S(mx2-1)
12
10.075
1.5
1.2
S(mx2-1)
Ø 4
Ground con tact
Y
X
7.6
1.5
+0.10
-0.15
Signal con tact
Detail
S(1)
Sheild c over
1.5
X
1.3
Ground con tact
He xagon sc rew
6.1
S(2)
(Center of dimension value 1.3mm)
G(1)
9.2
Signal con tact
1.5
Ground con tact
Sheild c over
S(1)
6.7
He xagon sc rew
Detail
Scale
X
5/1
Section Y-Y
S(1)
G(n)
S(mx2)
S(mx2-1)
S(1)
S(2)
G(1)
Ground terminal
height
Ground terminal
height
S(2)
G(1)
X
Section X-X
0.3
0.3
Signal terminal
height
Y
X
X
Ø 4
G(1)
7.6
+0.10
-0.15
1.3
Ground con tact
6.1
(Center of dimension value 1.3mm)
2-M2.5
9.2
X
S(mx2)
2-M2.5
Gas ket
Detail
X
S(1)
S(2)
5.8 Max
Solder po st
Section X-X
0.3
Signal terminal
height
Front su rface of shield c over
to top of he xagon sc rew
Unit: mm
Detail
6.7
X
5/1
Scale
n
RECOMMENDED PCP LAYOUT
S(mx2)
S(1)
S(mx2-1)
S(2)
G(n)
G(1)
FCN-268D0**-G/1*
WITH ALIGNMENT PIN
Section Y-Y
0.3
2-Ø 1.8
FCN-268D0**-G/1*
WITH ALIGNMENT PIN
Detail
A
Detail
A
Detail B
Detail B
1.25
1.25
0.15
0.15
0.5
0.5
1.075
1.075
4.1
4.1
2-Ø 1.8
J6
J6
J7
J7
4.75
4.75
Detail A
Detail A
0.15
0.15
1.25
1.25
0.5
0.5
Detail B
Detail B
J6
J6
J7
J7
0.15
0.15
G(n)
G(n)
J8
J8
4.75
4.75
0.15
0.15
1.075
1.075
Detail
A
A
Detail
4.1
4.1
J7± 0.05
J6± 0.05
7.65
Detail
7.65
Detail
A
A
4.75±0.05
Detail C
Detail C
0.305±0.025
0.305 ±0.025
0.305±0.025
0.305 ±0.025
G(1)
G(1)
2.6±0.05
2.6 ±0.05
+0.05
2.6
00
2.6
+0.05
Detail B
Detail B
(P.T.H)
(P.T.H)
2-Ø 2.2 ±0.05
FCN-268D0**-G/2*
WITH CRUSH PIN
Detail B
Detail B
9
9
G(n)
Detail
G(n)
D
Detail D
J8
J8
J7± 0.05
J6± 0.05
7.65
7.65
4.75±0.05
S(2)
S(2)
S(1)
S(1)
0.305±0.025
0.305 ±0.025
0.305±0.025
0.305 ±0.025
2.6
+0.05
2.6
00
+0.05
4-0.15
4-0.15
3.9±0.05
3.9 ±0.05
5.9 ±0.05
5.9±0.05
4.6
-0.05
4.6
-0.05
6.7
6.7
-0.05
2.6±0.05
2.6 ±0.05
1.82
+0.05
1.82
00
+0.05
2.6
00
2.6
+0.05
+0.05
Edge of P.C.B
S(mx2)
S(mx2-1)
3.9±0.05
3.9 ±0.05
00
4.6
-0.05
4.6
-0.05
5.9 ±0.05
5.9±0.05
2.6
+0.05
2.6
00
+0.05
Detail
Detail D
D
{(p-1)x0.5+1.25±0.05}
Ø
1.82
+0.05
Ø 1.82
00
6.7
6.7
-0.05
•
•
•
•
m: Number of signal pin
{(p-1)x0.5+1.25±0.05}
Detail
Detail D
D
n : Number of ground pin
p : Number of terminals (total number of signal+, signal-, ground terminals)
Detail C
Detail C
P.T.H: Plated Through hole. Dimensions after soldering shall meet spefified size.
Connector pins shall be fixed by solder or equivalent method after inserting connector pins to plated through hole.
• m: Number of signal pin
• Please see speficication sheet about component mounting prohibited area.
• n : Number of ground pin
• p : Number of terminals (total number of signal+, signal-, ground terminals)
• P.T.H: Plated Through hole. Dimensions after soldering shall meet spefified size.
Connector pins shall be fixed by solder or equivalent method after inserting connector pins to plated through hole.
• Please see speficication sheet about component mounting prohibited area.
1.82
+0.05
1.82
00
+0.05
Detail
Detail B
2-Ø 1.8
Detail
Detail B
Unit: mm
Unit: mm
Specifications subject to change
http://us.fujitsu.com/connectors
1.88
1.88
Detail C
Detail C
2-Ø 1.8
0
0
1.88
1.88
2-Ø
Edge of P.C.B
2.2 ±0.05
(P.T.H)
(P.T.H)
S(mx2)
Detail
Detail
D
S(mx2-1)
D
Detail C
Detail C
FCN-268D0**-G/2*
WITH CRUSH PIN
4-0.15
4-0.15
G(1)
G(1)
S(2)
S(2)
S(1)
S(1)
Ø
1.82
+0.05
Ø 1.82
00
00
0
0
9
9
4
microGiGaCN™ FCN- 260 (D) Series
CABLE I/O JACK SCREW LOCK TYPE - WITH DIAMOND PIN
n
DIMENSIONS / RECOMMENDED PCP LAYOUT
1.5
J9
J10
4.75
0.15
0.15
0.5
Detail G
7.39
+0.3
0
1.25
1.8
Detail H
Detail G
Ø 1.8
Alignment pin
Detail H
Front su rface of shield c over
to top of h exagon sc rew
5.8 Max
Solder po st
Ø 4
10.075
7.6
+0.10
-0.15
1.3
6.1
(Center of dimension value 1.3mm)
9.2
G(n)
2-Ø 2.2 ±0.05
(P.T.H.)
J11±0.05
J10±0.05
J9±0.05
7.65
4.75 ±0.05
Detail J
0.305 ±0.025
X
0.305 ±0.025
G(1)
S(2)
S(1)
3.9 ±0.05
0
4.6
-0.05
5.9 ±0.05
0
6.7
-0.05
2.6
+0.05
0
S(mx2-1)
2.6
S(mx2)
+0.05
0
9
Edge of P.C.B
2- Ø1.82
+0.05
0
{(p-1)x0.5+ 1.25 ±0.05
Detail J
m: Number of signal pin
n : Number of ground pin
p : Number of terminals (total number of signal+, signal-, ground terminals)
P.T.H: Plated Through hole. Dimensions after soldering shall meet spefified size.
Connector pins shall be fixed by solder or equivalent method after inserting connector pins to plated through hole.
• Please see speficication sheet about component mounting prohibited area.
•
•
•
•
Specifications subject to change
http://us.fujitsu.com/connectors
5
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