27.4 A, 200 V, 0.105 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-254AA
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Maker | International Rectifier （ Infineon ） |
| Parts packaging code | TO-254AA |
| package instruction | FLANGE MOUNT, S-MSFM-P3 |
| Contacts | 3 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | HIGH RELIABILITY |
| Avalanche Energy Efficiency Rating (Eas) | 500 mJ |
| Shell connection | ISOLATED |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 200 V |
| Maximum drain current (ID) | 27.4 A |
| Maximum drain-source on-resistance | 0.105 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code | TO-254AA |
| JESD-30 code | S-MSFM-P3 |
| Number of components | 1 |
| Number of terminals | 3 |
| Operating mode | ENHANCEMENT MODE |
| Package body material | METAL |
| Package shape | SQUARE |
| Package form | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Maximum pulsed drain current (IDM) | 110 A |
| Certification status | Not Qualified |
| Guideline | MIL-19500/592 |
| surface mount | NO |
| Terminal form | PIN/PEG |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Base Number Matches | 1 |
| JANTXV2N7225 | JANTX2N7225 | |
|---|---|---|
| Description | 27.4 A, 200 V, 0.105 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-254AA | POWER, FET |
| Is it lead-free? | Contains lead | Contains lead |
| Maker | International Rectifier （ Infineon ） | International Rectifier （ Infineon ） |
| Parts packaging code | TO-254AA | TO-254AA |
| package instruction | FLANGE MOUNT, S-MSFM-P3 | FLANGE MOUNT, S-MSFM-P3 |
| Contacts | 3 | 3 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Other features | HIGH RELIABILITY | HIGH RELIABILITY |
| Avalanche Energy Efficiency Rating (Eas) | 500 mJ | 500 mJ |
| Shell connection | ISOLATED | ISOLATED |
| Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 200 V | 200 V |
| Maximum drain current (ID) | 27.4 A | 27.4 A |
| Maximum drain-source on-resistance | 0.105 Ω | 0.105 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code | TO-254AA | TO-254AA |
| JESD-30 code | S-MSFM-P3 | S-MSFM-P3 |
| Number of components | 1 | 1 |
| Number of terminals | 3 | 3 |
| Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE |
| Package body material | METAL | METAL |
| Package shape | SQUARE | SQUARE |
| Package form | FLANGE MOUNT | FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL | N-CHANNEL |
| Maximum pulsed drain current (IDM) | 110 A | 110 A |
| Certification status | Not Qualified | Not Qualified |
| Guideline | MIL-19500/592 | MIL-19500/592 |
| surface mount | NO | NO |
| Terminal form | PIN/PEG | PIN/PEG |
| Terminal location | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON |
| Base Number Matches | 1 | 1 |
RF/Wirelessly
Analogue and Mixed Signal
Mobile and portable
Mobile and portable
DSP and ARM Processors
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