HY57V281620HCLT-P datasheet, PDF

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HY57V281620HCLT-P: Description4 Banks x 2M x 16bits Synchronous DRAM; Categorystorage storage; File Size95KB，13 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY57V281620HCLT-P Overview

4 Banks x 2M x 16bits Synchronous DRAM

HY57V281620HCLT-P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP54,.46,32
Contacts	54
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PDSO-G54
JESD-609 code	e6
length	22.238 mm
memory density	134217728 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	54
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP54,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.194 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.001 A
Maximum slew rate	0.2 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Bismuth (Sn/Bi)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	10.16 mm

HY57V281620HCLT-P Related Products

	HY57V281620HCLT-P	HY57V281620HCT-7	HY57V281620HCT	HY57V281620HCLT-S	HY57V281620HCLT-K	HY57V281620HCLT-H	HY57V281620HCLT-8	HY57V281620HCLT-6	HY57V281620HCLT-7
Description	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM	4 Banks x 2M x 16bits Synchronous DRAM
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible	-	incompatible	incompatible
Maker	SK Hynix	SK Hynix	-	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	TSOP2	TSOP2	-	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	-	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32
Contacts	54	54	-	54	54	54	54	54	54
Reach Compliance Code	compli	unknow	-	compli	compli	compli	unknow	compli	compli
ECCN code	EAR99	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	6 ns	5.4 ns	-	6 ns	5.4 ns	5.4 ns	6 ns	5.4 ns	5.4 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz	143 MHz	-	100 MHz	133 MHz	133 MHz	125 MHz	166 MHz	143 MHz
I/O type	COMMON	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	1,2,4,8	1,2,4,8	-	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	R-PDSO-G54	R-PDSO-G54	-	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54
length	22.238 mm	22.238 mm	-	22.238 mm	22.238 mm	22.238 mm	22.238 mm	22.238 mm	22.238 mm
memory density	134217728 bi	134217728 bi	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	16	16	-	16	16	16	16	16	16
Number of functions	1	1	-	1	1	1	1	1	1
Number of ports	1	1	-	1	1	1	1	1	1
Number of terminals	54	54	-	54	54	54	54	54	54
word count	8388608 words	8388608 words	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	-	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8MX16	8MX16	-	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	-	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
Encapsulate equivalent code	TSOP54,.46,32	TSOP54,.46,32	-	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	-	4096	4096	4096	4096	4096	4096
Maximum seat height	1.194 mm	1.194 mm	-	1.194 mm	1.194 mm	1.194 mm	1.194 mm	1.194 mm	1.194 mm
self refresh	YES	YES	-	YES	YES	YES	YES	YES	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	0.001 A	0.001 A	-	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.2 mA	0.24 mA	-	0.2 mA	0.22 mA	0.22 mA	0.2 mA	0.24 mA	0.24 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	-	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	20	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	10.16 mm	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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