512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Winbond Electronics Corporation |
| Parts packaging code | QFJ |
| package instruction | PLASTIC, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum access time | 11 ns |
| Other features | SYNCHRONOUS BURST MODE ALSO POSSIBLE |
| startup block | TOP |
| command user interface | NO |
| Data polling | YES |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 4194304 bi |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of departments/size | 8 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 3.3 V |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum seat height | 3.56 mm |
| Department size | 64K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| switch bit | YES |
| type | NOR TYPE |
| width | 11.43 mm |
| W39V040FBP | W39V040FB | W39V040FBPZ | W39V040FBQ | W39V040FBQZ | |
|---|---|---|---|---|---|
| Description | 512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE | 512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE | 512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE | 512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE | 512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE |
| Is it Rohs certified? | incompatible | - | conform to | conform to | conform to |
| Maker | Winbond Electronics Corporation | - | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation |
| Parts packaging code | QFJ | - | QFJ | TSOP | TSOP |
| package instruction | PLASTIC, LCC-32 | - | LEAD FREE, PLASTIC, LCC-32 | 8 X 14 MM, STSOP-32 | TSSOP, TSSOP32,.56,20 |
| Contacts | 32 | - | 32 | 32 | 32 |
| Reach Compliance Code | _compli | - | unknow | compli | compli |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Maximum access time | 11 ns | - | 11 ns | 11 ns | 11 ns |
| Other features | SYNCHRONOUS BURST MODE ALSO POSSIBLE | - | SYNCHRONOUS BURST MODE ALSO POSSIBLE | SYNCHRONOUS BURST MODE ALSO POSSIBLE | SYNCHRONOUS BURST MODE ALSO POSSIBLE |
| startup block | TOP | - | TOP | TOP | TOP |
| command user interface | NO | - | NO | NO | NO |
| Data polling | YES | - | YES | YES | YES |
| JESD-30 code | R-PQCC-J32 | - | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | - | e3 | e0 | e0 |
| length | 13.97 mm | - | 13.97 mm | 12.4 mm | 12.4 mm |
| memory density | 4194304 bi | - | 4194304 bi | 4194304 bi | 4194304 bi |
| Memory IC Type | FLASH | - | FLASH | FLASH | FLASH |
| memory width | 8 | - | 8 | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 | 1 |
| Number of departments/size | 8 | - | 8 | 8 | 8 |
| Number of terminals | 32 | - | 32 | 32 | 32 |
| word count | 524288 words | - | 524288 words | 524288 words | 524288 words |
| character code | 512000 | - | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | - | 512KX8 | 512KX8 | 512KX8 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | - | QCCJ | TSSOP | TSSOP |
| Encapsulate equivalent code | LDCC32,.5X.6 | - | LDCC32,.5X.6 | TSSOP32,.56,20 | TSSOP32,.56,20 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | - | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | - | 245 | 240 | NOT SPECIFIED |
| power supply | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| Programming voltage | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| ready/busy | YES | - | YES | YES | YES |
| Maximum seat height | 3.56 mm | - | 3.56 mm | 1.2 mm | 1.2 mm |
| Department size | 64K | - | 64K | 64K | 64K |
| Maximum standby current | 0.00005 A | - | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.03 mA | - | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | - | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | - | YES | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | - | MATTE TIN | TIN LEAD | - |
| Terminal form | J BEND | - | J BEND | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | - | 1.27 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | - | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | - | 40 | 30 | NOT SPECIFIED |
| switch bit | YES | - | YES | YES | YES |
| type | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 11.43 mm | - | 11.43 mm | 8 mm | 8 mm |
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