W39V040FB datasheet, PDF - EEWORLD Datasheet

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W39V040FB: Description512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE; File Size366KB，33 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W39V040FB Overview

512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE

W39V040FB Related Products

	W39V040FB	W39V040FBPZ	W39V040FBP	W39V040FBQ	W39V040FBQZ
Description	512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE	512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE	512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE	512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE	512K X 8 CMOS FLASH MEMORY WITH FWH INTERFACE
Is it Rohs certified?	-	conform to	incompatible	conform to	conform to
Maker	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	-	QFJ	QFJ	TSOP	TSOP
package instruction	-	LEAD FREE, PLASTIC, LCC-32	PLASTIC, LCC-32	8 X 14 MM, STSOP-32	TSSOP, TSSOP32,.56,20
Contacts	-	32	32	32	32
Reach Compliance Code	-	unknow	_compli	compli	compli
ECCN code	-	EAR99	EAR99	EAR99	EAR99
Maximum access time	-	11 ns	11 ns	11 ns	11 ns
Other features	-	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE
startup block	-	TOP	TOP	TOP	TOP
command user interface	-	NO	NO	NO	NO
Data polling	-	YES	YES	YES	YES
JESD-30 code	-	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	-	e3	e0	e0	e0
length	-	13.97 mm	13.97 mm	12.4 mm	12.4 mm
memory density	-	4194304 bi	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	-	FLASH	FLASH	FLASH	FLASH
memory width	-	8	8	8	8
Number of functions	-	1	1	1	1
Number of departments/size	-	8	8	8	8
Number of terminals	-	32	32	32	32
word count	-	524288 words	524288 words	524288 words	524288 words
character code	-	512000	512000	512000	512000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C
organize	-	512KX8	512KX8	512KX8	512KX8
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	QCCJ	QCCJ	TSSOP	TSSOP
Encapsulate equivalent code	-	LDCC32,.5X.6	LDCC32,.5X.6	TSSOP32,.56,20	TSSOP32,.56,20
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	245	225	240	NOT SPECIFIED
power supply	-	3.3 V	3.3 V	3.3 V	3.3 V
Programming voltage	-	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	-	YES	YES	YES	YES
Maximum seat height	-	3.56 mm	3.56 mm	1.2 mm	1.2 mm
Department size	-	64K	64K	64K	64K
Maximum standby current	-	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	-	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	MATTE TIN	TIN LEAD	TIN LEAD	-
Terminal form	-	J BEND	J BEND	GULL WING	GULL WING
Terminal pitch	-	1.27 mm	1.27 mm	0.5 mm	0.5 mm
Terminal location	-	QUAD	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	-	40	30	30	NOT SPECIFIED
switch bit	-	YES	YES	YES	YES
type	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	-	11.43 mm	11.43 mm	8 mm	8 mm

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