Audio Amplifiers 1W Audio Power
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOIC |
| package instruction | TSSOP, TSSOP8,.19 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Nominal bandwidth | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e0 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 1.08 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.19 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 2.5/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Maximum slew rate | 5.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.2 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| Base Number Matches | 1 |
| NCP2890DMR2 | NCP2890AFCT2 | |
|---|---|---|
| Description | Audio Amplifiers 1W Audio Power | Audio Amplifiers 1W Audio Power |
| Is it Rohs certified? | incompatible | incompatible |
| Parts packaging code | SOIC | BGA |
| package instruction | TSSOP, TSSOP8,.19 | VFBGA, BGA9,3X3,20 |
| Contacts | 8 | 9 |
| Reach Compliance Code | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 |
| Nominal bandwidth | 20 kHz | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | S-PDSO-G8 | S-PBGA-B9 |
| JESD-609 code | e0 | e0 |
| length | 3 mm | 1.45 mm |
| Humidity sensitivity level | 1 | 1 |
| Number of channels | 1 | 1 |
| Number of functions | 1 | 1 |
| Number of terminals | 8 | 9 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Nominal output power | 1.08 W | 1.08 W |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | VFBGA |
| Encapsulate equivalent code | TSSOP8,.19 | BGA9,3X3,20 |
| Package shape | SQUARE | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 240 | 235 |
| power supply | 2.5/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.1 mm | 0.66 mm |
| Maximum slew rate | 5.5 mA | 5.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.2 V | 2.2 V |
| surface mount | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | BALL |
| Terminal pitch | 0.65 mm | 0.5 mm |
| Terminal location | DUAL | BOTTOM |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED |
| width | 3 mm | 1.45 mm |
| Base Number Matches | 1 | 1 |
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