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89H32H8G2ZCBLG8

Description
PCI Interface IC PCIE GEN2 SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size245KB,40 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89H32H8G2ZCBLG8 Overview

PCI Interface IC PCIE GEN2 SWITCH

89H32H8G2ZCBLG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionBGA,
Contacts484
Manufacturer packaging codeBLG484
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionFLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
Other featuresHAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY.
Bus compatibilityI2C; ISA; SMBUS; VGA
Maximum data transfer rate32000 MBps
JESD-30 codeS-PBGA-B484
JESD-609 codee1
length23 mm
Humidity sensitivity level4
Number of terminals484
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
Maximum seat height3.32 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width23 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI

89H32H8G2ZCBLG8 Related Products

89H32H8G2ZCBLG8 89H32H8G2ZCBLI 89H32H8G2ZCBLGI
Description PCI Interface IC PCIE GEN2 SWITCH PCI Interface IC PCIE GEN2 SWITCH PCI Interface IC PCIE GEN2 SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Contains lead Lead free
Is it Rohs certified? conform to incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA
package instruction BGA, 23 X 23 MM, 1 MM PITCH, FCBGA-484 BGA, BGA484,22X22,40
Contacts 484 484 484
Manufacturer packaging code BLG484 BL484 BLG484
Reach Compliance Code compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99
Other features HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. OPERATES AT 125 MHZ CLOCK FREQUENCY OPERATES AT 125 MHZ CLOCK FREQUENCY
Bus compatibility I2C; ISA; SMBUS; VGA I2C; ISA; VGA; SMBUS I2C; ISA; VGA; SMBUS
Maximum data transfer rate 32000 MBps 32 MBps 32 MBps
JESD-30 code S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
JESD-609 code e1 e0 e1
length 23 mm 23 mm 23 mm
Humidity sensitivity level 4 4 4
Number of terminals 484 484 484
Maximum operating temperature 70 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 245 225 245
Maximum seat height 3.32 mm 3.32 mm 3.32 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Samacsys Description FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH - FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH
maximum clock frequency - 100 MHz 100 MHz
Drive interface standards - IEEE 1149.6AC; IEEE 1149.1 IEEE 1149.6AC; IEEE 1149.1
Encapsulate equivalent code - BGA484,22X22,40 BGA484,22X22,40
power supply - 1,2.5/3.3 V 1,2.5/3.3 V
Certification status - Not Qualified Not Qualified
Maximum slew rate - 5336 mA 5336 mA

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