|
89H32H8G2ZCBLG8 |
89H32H8G2ZCBLI |
89H32H8G2ZCBLGI |
Description |
PCI Interface IC PCIE GEN2 SWITCH |
PCI Interface IC PCIE GEN2 SWITCH |
PCI Interface IC PCIE GEN2 SWITCH |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Is it lead-free? |
Lead free |
Contains lead |
Lead free |
Is it Rohs certified? |
conform to |
incompatible |
conform to |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
Parts packaging code |
FCBGA |
FCBGA |
FCBGA |
package instruction |
BGA, |
23 X 23 MM, 1 MM PITCH, FCBGA-484 |
BGA, BGA484,22X22,40 |
Contacts |
484 |
484 |
484 |
Manufacturer packaging code |
BLG484 |
BL484 |
BLG484 |
Reach Compliance Code |
compliant |
not_compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Other features |
HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. |
OPERATES AT 125 MHZ CLOCK FREQUENCY |
OPERATES AT 125 MHZ CLOCK FREQUENCY |
Bus compatibility |
I2C; ISA; SMBUS; VGA |
I2C; ISA; VGA; SMBUS |
I2C; ISA; VGA; SMBUS |
Maximum data transfer rate |
32000 MBps |
32 MBps |
32 MBps |
JESD-30 code |
S-PBGA-B484 |
S-PBGA-B484 |
S-PBGA-B484 |
JESD-609 code |
e1 |
e0 |
e1 |
length |
23 mm |
23 mm |
23 mm |
Humidity sensitivity level |
4 |
4 |
4 |
Number of terminals |
484 |
484 |
484 |
Maximum operating temperature |
70 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
BGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
245 |
225 |
245 |
Maximum seat height |
3.32 mm |
3.32 mm |
3.32 mm |
Maximum supply voltage |
1.1 V |
1.1 V |
1.1 V |
Minimum supply voltage |
0.9 V |
0.9 V |
0.9 V |
Nominal supply voltage |
1 V |
1 V |
1 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
23 mm |
23 mm |
23 mm |
uPs/uCs/peripheral integrated circuit type |
BUS CONTROLLER, PCI |
BUS CONTROLLER, PCI |
BUS CONTROLLER, PCI |
Samacsys Description |
FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH |
- |
FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH |
maximum clock frequency |
- |
100 MHz |
100 MHz |
Drive interface standards |
- |
IEEE 1149.6AC; IEEE 1149.1 |
IEEE 1149.6AC; IEEE 1149.1 |
Encapsulate equivalent code |
- |
BGA484,22X22,40 |
BGA484,22X22,40 |
power supply |
- |
1,2.5/3.3 V |
1,2.5/3.3 V |
Certification status |
- |
Not Qualified |
Not Qualified |
Maximum slew rate |
- |
5336 mA |
5336 mA |