Logic Gates QUAD 2-INPUT NAND GATE
| Parameter Name | Attribute value |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP14,.25 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | ABT |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e4 |
| length | 5 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.02 A |
| Humidity sensitivity level | 1 |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP14,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Maximum supply current (ICC) | 0.05 mA |
| Prop。Delay @ Nom-Sup | 4.1 ns |
| propagation delay (tpd) | 3.4 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 1.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 4.4 mm |
| Base Number Matches | 1 |
| 74ABT00PW-T | 74ABT00N | 74ABT00D | 74ABT00DB-T | 74ABT00PW | 74ABT00DB | |
|---|---|---|---|---|---|---|
| Description | Logic Gates QUAD 2-INPUT NAND GATE | Logic Gates QUAD 2-INPUT NAND GATE | Logic Gates QUAD 2-IN NAND GATE | Logic Gates QUAD 2-INPUT NAND GATE | Logic Gates QUAD 2-INPUT NAND GATE | Logic Gates QUAD 2-INPUT NAND GATE |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | TSSOP | DIP | SOIC | SSOP2 | TSSOP | SSOP2 |
| package instruction | TSSOP, TSSOP14,.25 | 0.300 INCH, PLASTIC, DIP-14 | PLASTIC, SO-14 | SSOP, SSOP14,.3 | PLASTIC, TSSOP1-14 | PLASTIC, SSOP2-14 |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| series | ABT | ABT | ABT | ABT | ABT | ABT |
| JESD-30 code | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 5 mm | 19.025 mm | 8.65 mm | 6.2 mm | 5 mm | 6.2 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | SOP | SSOP | TSSOP | SSOP |
| Encapsulate equivalent code | TSSOP14,.25 | DIP14,.3 | SOP14,.25 | SSOP14,.3 | TSSOP14,.25 | SSOP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Prop。Delay @ Nom-Sup | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns |
| propagation delay (tpd) | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| Maximum seat height | 1.1 mm | 4.2 mm | 1.75 mm | 2 mm | 1.1 mm | 2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | 30 | 30 | 30 | 30 |
| width | 4.4 mm | 7.62 mm | 3.9 mm | 5.3 mm | 4.4 mm | 5.3 mm |
| Humidity sensitivity level | 1 | - | 1 | 1 | 1 | 1 |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - |
| Is it lead-free? | - | Lead free | Lead free | - | Lead free | Lead free |
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